tag: Promex Industries

Services Beyond Packaging, Summer 2022 Newsletter
By QP Technologies - 15 Sep, 2022 - Comments: 0

Technology Focus: Services Services Beyond Packaging: QP Technologies is known for offering a wide range of package types. We also provide a variety of semiconductor manufacturing services to meet your packaging and assembly requirements. These include wafer preparation (backgrinding, dicing, die sort and inspection), IC assembly processes for a variety of package types and materials, laser ... » read more

Fan-Out Packaging Gets Competitive
By Karen Heyman and Laura Peters - 18 Aug, 2022 - Comments: 0

Fan-out wafer-level packaging (FOWLP) is a key enabler in the industry shift from transistor scaling to system scaling and integration. The design fans out the chip interconnects through a redistribution layer instead of a substrate. Compared to flip-chip ball grid array (FCBGA) or wire bonds, it creates lower thermal resistance, a slimmer package, and potentially lower costs. Yet, if the h... » read more

Equipment Suppliers Brace For GaN Market Explosion
By Adele Hars - 18 Aug, 2022 - Comments: 0

A huge GaN market is opening up, driven by consumer devices and the need for greater energy efficiency across many applications. Suppliers are ready, but to fully compete with SiC in high-voltage automotive applications will require further technological developments in power GaN (gallium nitride). Still, the 2020s mark a very high-growth phase for GaN markets. Revenues in the power GaN mark... » read more

Fab Investments Head Toward Record High
By Marie C. Baca - 27 Jul, 2022 - Comments: 0

Corporations and governments around the globe are making record-breaking investments in chip manufacturing plants amid a major push to make the semiconductor supply chain more robust and less prone to shortages caused by everything from market variations to geopolitical interruptions. These investments — which range from updating existing fabrication facilities to building entirely new fab... » read more

U.S. Chip Packaging With Mil-Spec Precision
By QP Technologies - 21 Jul, 2022 - Comments: 0

Download this white paper to learn: How you can transform your plastic package dummies, test rejects, and excess inventory into ready-to-assemble components The value of an onshore solution for navigating around ITAR supply constraints The benefits from producing chip prototypes that are mechanically and electrically identical to future molded production parts Why Open-Cavity Plas... » read more

SiPs And MCMs Broaden Opportunities For Military-Aerospace System Design
By Rosie Medina - 23 May, 2022 - Comments: 0

Military and aerospace (mil-aero) applications, from satellites and rockets to ships and planes, increasingly require electronic systems and subsystems with high functionality and performance in a small form factor. Meeting these demands poses higher-level challenges for packaging of these microelectronic devices, which needs to be rugged, long-lived, and affordable. Usage of multi-chip modu... » read more

Wafer Shortage Improvement In Sight For 300mm, But Not 200mm
By Adele Hars - 19 May, 2022 - Comments: 2

The supply chain for bare wafers is off-kilter. Demand is appreciably higher than the wafer suppliers can keep up with, creating shortages that could last for years. For 300mm starting wafers, the top five big players — SEH and Sumco of Japan, Siltronic of Germany, GlobalWafers of Taiwan, and SK Siltron of Korea — finally took action over the last year, spending billions on new wafer fac... » read more

Durability And Cost Benefits Drive Mil-Aero Demand For OCPP
By QP Technologies - 20 Apr, 2022 - Comments: 0

Ceramic packages were, for many years, the option of choice for semiconductor prototype assembly, particularly in military-aerospace applications. They are able to withstand high temperatures and can be hermetically sealed. However, they can be costly and, while they allow for rapid assembly of first samples, the final product is typically a plastic package, so the ceramic prototype doesn’t o... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 11 Mar, 2022 - Comments: 0

Chipmakers and OEMs Apple has rolled out its most powerful processor, dubbed the M1 Ultra, a multi-die chip that incorporates the company's new packaging technology. The M1 Ultra is incorporated in Apple’s new Mac Studio desktop. M1 Ultra features a 20-core CPU, a 64-core GPU, and a 32-core Neural Engine. The M1 Ultra also features UltraFusion, Apple’s new packaging architecture. M1 Ult... » read more

Technology Advances, Shortages Seen For Wire Bonders
By Mark LaPedus - 17 Feb, 2022 - Comments: 2

A surge in demand for IC packages is causing long lead times for wire bonders, which are used to assemble three-fourths of the world’s packages. The wire bonder market doubled last year, alongside advanced packaging’s rise. Wirebonding is an older technology that typically flies under the radar. Still, packaging houses have multitudes of these key tools that help assemble many — but no... » read more

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