tag: proteanTecs

Battling Over Shrinking Physical Margin In Chips
By Ed Sperling - 31 Jul, 2023 - Comments: 0

Smaller process nodes, coupled with a continual quest to add more features into designs, are forcing chipmakers and systems companies to choose which design and manufacturing groups have access to a shrinking pool of technology margin. In the past margin largely was split between the foundries, which imposed highly restrictive design rules (RDRs) to compensate for uncertainties in new proces... » read more

DAC/SEMICON West 2023 Roundup
By The SE Staff - 17 Jul, 2023 - Comments: 0

The interdependence of semiconductor devices and companies in manufacturing was a recurring theme at this year's SEMICON West, both in presentations and one-on-one discussions. Challenges range from sharing data securely across a highly integrated supply chain, particularly in light of heterogeneous integration, security concerns, and the increased use of AI, as well as concerns about the robus... » read more

Week In Review: Semiconductor Manufacturing, Test
By Gregory Haley - 14 Jul, 2023 - Comments: 0

SEMICON West returned in force this week, with a focus on AI and deep learning  in semiconductor manufacturing, security, heterogenous ICs, and the march toward a $1 trillion chip market. Lam Research President and CEO, Tim Archer, opened with the keynote presentation. Fig. 1: SEMICON West panel: AI’s influence on growth, China-U.S. trade war, and the importance of climate policy were... » read more

DAC/Semicon West Addresses Top Issues, Trends For Chips
By The SE Staff - 12 Jul, 2023 - Comments: 0

The Design Automation Conference (DAC) 2023 and Semicon West returned in full force this week, drawing in more attendees and sponsor companies than since before the pandemic. At times, booth traffic was four to five deep, blocking aisles, and standing room only was common at presentations. Hot topics included generative AI and the underlying semiconductor technology, data security, reliabili... » read more

The Future Of Chiplet Reliability
By Nir Sever - 11 Jul, 2023 - Comments: 0

Chipmakers are increasingly turning to advanced packaging to overcome the reticle size limit of silicon manufacturing without increasing transistor density. This method also allows hybrid devices with dies in different process nodes while improving yield, which decreases exponentially with size. However, 2.5D/3D designs introduce a fair share of new challenges, one of the most significant be... » read more

Pinpointing Timing Delays in Complex SoCs
By Anne Meixner - 11 Jul, 2023 - Comments: 0

Telemetry circuits are becoming a necessity in complex heterogeneous chips and packages to show how these devices are behaving post-production, but fusing together relevant data to identify the sources of problems adds its own set of challenges. In the past, engineering teams could build margin into chips to offset any type of variation. But at advanced nodes and in advanced packages, tolera... » read more

Week In Review: Semiconductor Manufacturing, Test
By Gregory Haley - 07 Jul, 2023 - Comments: 0

China retaliated against a U.S. embargo on advanced semiconductor equipment exports by restricting exports of gallium and germanium. Both metals are widely used in semiconductors and electric vehicles. Despite export controls for advanced chips and equipment imposed on Chinese foundries by the U.S. and its allies, TrendForce predicts China's 300mm market share likely will increase from 24% ... » read more

Week In Review: Auto, Security, Pervasive Computing
By Liz Allan - 16 Jun, 2023 - Comments: 0

The European Parliament took a major step toward enacting the world’s first laws around the use of AI. Known as the AI Act, the draft law won a majority vote following two years of debate. If the proposed regulations pass the next hurdles, AI systems posing an unacceptable risk to human safety would be banned — along with “intrusive and discriminatory” uses of AI, including biometric su... » read more

Week In Review: Semiconductor Manufacturing, Test
By Gregory Haley - 16 Jun, 2023 - Comments: 0

Applied Materials sued its Chinese-owned rival, Mattson, over an alleged 14-month effort to steal valuable trade secrets, reports Bloomberg. In court filing, Applied Materials claimed that Mattson engaged in a spree of employee-poaching and covertly transferring semiconductor equipment designs. Global semiconductor materials revenue grew 8.9% to $72.7 billion in 2022, surpassing the previous... » read more

Ramping Up Power Electronics For EVs
By Anne Meixner - 06 Jun, 2023 - Comments: 0

The rapid acceleration of the power devices used in electric vehicles (EVs) is challenging chipmakers to adequately screen the ICs that power these vehicles.[1] While progress toward autonomous driving is grabbing the public’s attention, the electrification of transportation systems is progressing quietly. For the automotive industry, this shift involves a mix of electronic components. Amo... » read more

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