tag: Pusan National University

Research Bits: April 4
By Jesse Allen - 04 Apr, 2023 - Comments: 0

Wet-like plasma etching Researchers from Nagoya University and Hitachi developed a new etch method called wet-like plasma etching that combines the selectivity of wet etching with the controllability of dry etching. The researchers say the technique will make it possible to etch complex structures such as metal carbides consisting of titanium (Ti) and aluminum (Al), such as TiC or TiAlC, wh... » read more

Chip Industry’s Technical Paper Roundup: Feb. 28
By Linda Christensen - 28 Feb, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=83 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us ... » read more

Solid-State Electrochemical Thermal Transistor Without Using Liquid
By Technical Paper Link - 24 Feb, 2023 - Comments: 0

A new technical paper titled "Solid-State Electrochemical Thermal Transistors" was published by researchers at Hokkaido University, Pusan National University, and the University of Tokyo. Abstract "Thermal transistors that electrically control heat flow have attracted growing attention as thermal management devices and phonon logic circuits. Although several thermal transistors are demons... » read more

Technical Paper Round-Up: March 29
By Linda Christensen - 29 Mar, 2022 - Comments: 0

Improving batteries, ultra low-power photonic edge computing, SLAM, Tellurium for 2D semiconductors, and reservoir computing top the past week's technical papers. The focus on energy is critical as the edge buildout continues and more devices are connected to a battery, while research into new architectures and materials that will continue scaling and improve performance per watt continue at th... » read more

Flat-surface-assisted and self-regulated oxidation resistance of Cu(111)
By Technical Paper Link - 22 Mar, 2022 - Comments: 0

Abstract "Oxidation can deteriorate the properties of copper that are critical for its use, particularly in the semiconductor industry and electro-optics applications. This has prompted numerous studies exploring copper oxidation and possible passivation strategies. In situ observations have, for example, shown that oxidation involves stepped surfaces: Cu2O growth occurs on flat surfaces as a ... » read more

Power/Performance Bits: Dec. 28
By Jesse Allen - 28 Dec, 2021 - Comments: 0

Shrinking LEDs Researchers from King Abdullah University of Science and Technology (KAUST) are working to make LEDs smaller. Micrometer-scale light-emitting diodes (μLEDs) could be an ideal building block for future microLED displays, but devices based on nitride-based alloys used to achieve a broad color range become poor emitters of light when shrunk to micrometer scales. “The main ... » read more

Manufacturing Bits: Oct. 6
By Mark LaPedus - 06 Oct, 2020 - Comments: 0

High-NA EUV mask materials A team of researchers have presented a new paper on the tradeoffs of photomask absorber materials for high-NA extreme ultraviolet (EUV) lithography. In the paper, researchers concluded that the industry will likely require an alternative mask absorber stack for high-numerical aperture (high-NA) EUV lithography. Fraunhofer, Imec, ASML and Zeiss contributed to the... » read more

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