tag: Qualcomm

Machine Learning Meets IC Design
By Brian Bailey - 29 Jun, 2017 - Comments: 2

Machine Learning (ML) is one of the hot buzzwords these days, but even though EDA deals with big-data types of issues it has not made much progress incorporating ML techniques into EDA tools. Many EDA problems and solutions are statistical in nature, which would suggest a natural fit. So why is it so slow to adopt machine learning technology, while other technology areas such as vision recog... » read more

Monday At DAC
By Brian Bailey - 20 Jun, 2017 - Comments: 1

The 54th DAC got started today in a very steamy Austin. While we may be a maturing industry, there is certainly no indications that the people within the industry have given up or intend to take it easy. The event really got started late Sunday when Laurie Balch, chief analyst for Gary Smith EDA, delivered her message. She said that the focus is becoming the verticals. "This change in focus is ... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 16 Jun, 2017 - Comments: 0

Chipmakers UMC has appointed two senior vice presidents--S.C. Chien and Jason Wang--as co-presidents of the company, following Po-Wen Yen’s retirement as UMC’s CEO. The co-presidents are accountable for the overall performance of UMC. They will report to UMC Chairman Stan Hung. Chien will focus on the core manufacturing and technology aspects of UMC, including R&D and operations. Wang wil... » read more

The Week In Review: IoT
By Jeff Dorsch - 16 Jun, 2017 - Comments: 0

Market Research International Data Corp. updated its Worldwide Semiannual Internet of Things Spending Guide, forecasting global IoT spending will increase 16.7% this year to more than $800 billion. The market research firm says the market will grow to almost $1.4 trillion by 2021. Manufacturing, smart grid technologies, freight monitoring, production asset management, and smart building techno... » read more

Architecture First, Node Second
By Ed Sperling - 15 Jun, 2017 - Comments: 0

What a difference a node makes. A couple of rather important changes have occurred in the move from 16/14 to 10/7nm (aside from more confusing naming conventions). First, companies that require more transistors—processor companies such as [getentity id="22846" e_name="Intel"], AMD, [getentity id="22306" comment="IBM"] and [getentity id="22676" e_name="Qualcomm"]—have come to grips with t... » read more

The Week In Review: IoT
By Jeff Dorsch - 09 Jun, 2017 - Comments: 0

Analysis Adam Greenfield writes about the privacy and technology issues raised by the Internet of Things in this piece, an adapted extract from his new book, "Radical Technologies: The Design of Everyday Life." “The Internet of Things presents many new possibilities, and it would be foolish to dismiss those possibilities out of hand. But we would also be wise to approach the entire domain wi... » read more

Security Issues Up With Heterogeneity
By Ann Mutschler - 05 Jun, 2017 - Comments: 0

The race toward heterogeneous designs is raising new security concerns across the semiconductor supply chain. There is more IP to track, more potential for unexpected interactions, and many more ways to steal data or IP. Security is a difficult problem no matter what kind of chip is involved, and it has been getting worse as more devices, machines and systems are connected to the Internet. B... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 02 Jun, 2017 - Comments: 0

Market research IC Insights has released its capital spending forecast by company. In total, there are 15 companies that are forecast to have semiconductor capital expenditures of $1.0 billion or more in 2017, up from 11 in 2016, according to IC Insights. Four companies—Intel, Samsung, GlobalFoundries, and SK Hynix—are expected to represent the bulk of the increase in spending, accord... » read more

The Race To 10/7nm
By Mark LaPedus - 22 May, 2017 - Comments: 4

Amid the ongoing ramp of 16/14nm processes in the market, the industry is now gearing up for the next nodes. In fact, GlobalFoundries, Intel, Samsung and TSMC are racing each other to ship 10nm and/or 7nm technologies. The current iterations of 10nm and 7nm technologies are scaled versions of today’s 16nm/14nm finFETs with traditional copper interconnects, high-k/metal-gate and low-k diele... » read more

Maintaining Power Profiles At 10/7nm
By Ann Mutschler - 17 May, 2017 - Comments: 0

Understanding power consumption in detail is now a must-have of electronic design at 10nm and below, putting more pressure on SoC verification to ensure a device not only works, but meets the power budget. As part of this, the complete system must be run in a realistic manner — at the system-level — when the design and verification teams are looking at the effects of power during hardwar... » read more

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