tag: Qualcomm

The Week In Review: Manufacturing
By Mark LaPedus - 19 Dec, 2014 - Comments: 0

This announcement could send some shock waves throughout the foundry business. For its baseband chips, Qualcomm uses several foundries, namely GlobalFoundries, Samsung and TSMC. Now, Qualcomm has another foundry partner. China’s Semiconductor Manufacturing International Corp. (SMIC) says that it has fabricated Qualcomm’s 28nm Snapdragon 410 processors. Snapdragon 410 is a processor that int... » read more

Unraveling The Mysteries At IEDM
By Mark LaPedus - 19 Dec, 2014 - Comments: 0

In some respects, the 2014 IEEE International Electron Devices Meeting (IEDM) was no different than past events. The event, held this week in San Francisco, included the usual and dizzying array of tutorials, sessions, papers and panels. On the leading-edge CMOS front, for example, the topics included [getkc id="82" kc_name="2.5D"]/[getkc id="42" kc_name="3D IC"] chips, III-V materials, [getkc ... » read more

Manufacturing Constraint Fears Grow
By Ed Sperling - 18 Dec, 2014 - Comments: 0

The semiconductor industry could become a victim of its own success. With so many semiconductors being consumed inside of cars, home electronics and industry, capacity shortages are beginning to surface in some areas. Foundries set rates depending upon a complex mix of process technology, equipment depreciation, customer demand and the need to push customers from one node the next depending ... » read more

The Week In Review: Design/IoT
By Ed Sperling - 05 Dec, 2014 - Comments: 0

Tools Calypto rolled out its third-generation high-level synthesis platform after three years of development, adding granular control over which regions are optimized and the ability to work top-down and bottom-up—basically allowing designers to zoom in and out as needed. In addition, the tool has a 10X increase in capacity and supports SystemC and C++. eSilicon unveiled its online conf... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 14 Nov, 2014 - Comments: 0

Intel’s McAfee unit announced its annual “12 Scams of the Holidays” list to educate the public on the most popular ways cybercriminals scam consumers during the holiday season. The German government has cleared Applied Materials’ proposed acquisition of Tokyo Electron Ltd. (TEL). The merger is still under examination by the competition authorities in the U.S., South Korea, Japan, Tai... » read more

Manufacturing Bits: Nov. 11
By Mark LaPedus - 11 Nov, 2014 - Comments: 0

Plastic smartwatch displays LG Display has begun production of what the company claims is the world’s first circular plastic OLED (P-OLED) display. The P-OLED is the display for the company’s new smartwatch, the LG G Watch R. Based on the Android Wear operating system, the smartwatch is powered by Qualcomm’s 1.2-GHz Snapdragon 400 processor. It also has 4GB of storage and 512MB of RAM... » read more

Week 20: Marketing Musings
By Anne Cirkel - 24 Oct, 2014 - Comments: 0

Last week I was on vacation in Pacific City at the Oregon Coast. We usually take our dogs there twice a year. They love the freedom to roam around on McPhillips Beach, less crowded than other beaches in the area, and we usually take them a couple of times up Cape Kiwanda’s Great Dune, more than 200 feet up. We were amazed how warm it still was and not just from the work of climbing the dune. ... » read more

Week 19: Ready. Steady. Go!
By Anne Cirkel - 17 Oct, 2014 - Comments: 2

The window for submitting to the IP and designer tracks opens on Oct. 23. It’s time to get ready and check with your management if you can present your work at DAC. You can find the submission details and a link to last year’s content here. You can even browse presentation examples from past designer tracks. If you are an EDA vendor, the designer track is a good opportunity for your use... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 17 Oct, 2014 - Comments: 0

It’s official: IBM appears to be exiting the chip business. After months of talks, IBM has agreed to pay GlobalFoundries $1.5 billion to take Big Blue’s chip unit off its hands, according to reports from Bloomberg. IBM will also receive $200 million worth of assets, according to the reports. At the upcoming IEEE International Electron Devices Meeting (IEDM), Intel and IBM will present... » read more

Embedded At DAC
By Anne Cirkel - 10 Oct, 2014 - Comments: 0

It seems to be one of DAC’s best kept secrets – right up there with what happened to Free Monday – that about 30% of the conference content is focused on embedded systems and software (ESS). The call for contributions is still open and I want to remind you that you can submit your research work in ESS to DAC. When Leon Stok of IBM was General Chair for the 48th DAC he started our embedded... » read more

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