tag: Qualcomm

The Trouble With Models
By Ed Sperling - 28 Jun, 2012 - Comments: 0

By Ann Steffora Mutschler Models and modeling concepts seem to be on the tip of every tongue these days. Once the promise of sparking true ESL design, the use of system-level models has settled into something more like enabling software development. There is also talk of leveraging models across the supply chain, but is this really possible yet? The concept of doing this incremental refinem... » read more

The 28nm Foundry Crunch
By Ed Sperling - 29 May, 2012 - Comments: 0

By Mark LaPedus Faced with huge and unforeseen demand at the 28nm node, leading-edge foundries are scrambling to play catch-up and are boosting their fab capacities at a staggering pace. But analysts warn that 28nm foundry capacity will be tight throughout 2012, and perhaps into 2013, putting some chipmakers in a pinch. Many blame the 28nm foundry capacity shortfall on a combination of t... » read more

Power Becomes Bigger Issue In Stacked Die
By Ed Sperling - 10 May, 2012 - Comments: 0

By Ed Sperling Concern over getting the heat out of stacked die is well defined, even if the current raft of existing and proposed solutions ranges from ineffective to exotic and expensive. What is less well understood is how to plan for and manage power inside of stacked die. While power and heat frequently go hand in hand—where there is heat there is almost always power dissipation—t... » read more

Gap Vs. Gap
By Ed Sperling - 26 Apr, 2012 - Comments: 0

By Ed Sperling Among tools vendors it’s been standard practice to listen closely to customers but not deliver everything they ask for—or at least not always on the customers’ timetable. This strategy has worked well enough for both sides in the past, but at 20nm and in stacked die configurations, the level of tension between these two worlds is increasing, and the gaps in the tool cha... » read more

3D Standards For The Real World
By Ed Sperling - 23 Feb, 2012 - Comments: 0

By Pallab Chatterjee Stacking die has progressed from what is technologically possible to what will be realistically feasible in a fabless or fab-lite world. The big challenges may be less about how to deal with stress caused by a TSV or thermal density and more about companies working together in a disaggregated supply chain. This was quite evident at a recent DesignCon panel dicussion on ... » read more

Processor Subject To Change
By Ed Sperling - 09 Feb, 2012 - Comments: 0

By Ann Steffora Mutschler With power complexity driving sophisticated management techniques, SoC design engineering teams are turning to a new class of customizable processor architectures from ARM, CEVA, NVIDIA, Qualcomm and Tensilica and others to take advantage of the best in power saving techniques. While these new architectures are novel approaches, the concepts are not especially new,... » read more

Experts At The Table: Stacked Die And The Supply Chain
By Ed Sperling - 13 Dec, 2011 - Comments: 0

By Ed Sperling Semiconductor Manufacturing & Design sat down to discuss the effects of stacking die on the supply chain with Stephen Pateras, production marketing director for silicon test at Mentor Graphics; Javier DeLaCruz, director of manufacturing technology at eSilicon; Colin Baldwin, director of marketing at Open-Silicon; Charles Woychik, director of marketing and technical analysis ... » read more

Experts At The Table: Stacked Die And The Supply Chain
By Ed Sperling - 05 Dec, 2011 - Comments: 0

By Ed Sperling Semiconductor Manufacturing & Design sat down to discuss the effects of stacking die on the supply chain with Stephen Pateras, production marketing director for silicon test at Mentor Graphics; Javier DeLaCruz, director of manufacturing technology at eSilicon; Colin Baldwin, director of marketing at Open-Silicon; Charles Woychik, director of marketing and technical analysis ... » read more

Experts At The Table: Stacked Die And The Supply Chain
By Ed Sperling - 26 Nov, 2011 - Comments: 0

By Ed Sperling Semiconductor Manufacturing & Design sat down to discuss the effects of stacking die on the supply chain with Stephen Pateras, production marketing director for silicon test at Mentor Graphics; Javier DeLaCruz, director of manufacturing technology at eSilicon; Colin Baldwin, director of marketing at Open-Silicon; Charles Woychik, director of marketing and technical analysis... » read more

Innovation At The Core
By Barry Pangrle - 03 Nov, 2011 - Comments: 0

By Barry Pangrle A number of next-generation ARM-based multi-core systems are starting to show up in the press. Nvidia has released information on its upcoming Tegra 3 (also known as “Kal El”). At last week’s ARM Techcon in Santa Clara, ARM gave several presentations around its Cortex-A7 (Kingfisher) and Cortex-A15 (Eagle) architectures and collectively about its big.LITTLE strategy. Qua... » read more

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