Where Power Is Spent In HBM


HBM is gaining ground because of a spike in the amount of data that needs to be processed quickly, but big reductions in power are possible if that processing can be moved closer to the HBM modules, and if more can be done in each compute cycle without sending data back and forth to memory as frequently. Steven Woo, fellow and distinguished engineer at Rambus, talks about what can be done to bo... » read more

Chip Industry’s Earnings Roundup


Editor's Note: Updated throughout February 2023 for additional earnings releases. Many companies reported revenue growth in the most recent quarter, but the latest round of chip industry earnings releases reflected some major themes: Demand for consumer electronics softened due to inflation, rising interest rates, and post-pandemic market saturation, creating a slump in the memory chip ... » read more

Week In Review: Auto, Security, Pervasive Computing


The United States Justice of Department asked Tesla for documents relating to its Autopilot driver assistance system and its Full Self-Driving (FSD). Among other tech company woes, some of which are leading to layoffs, Apple sales dropped 5% year over year and it missed its earnings target this quarter. The U.S. state of Kansas will commit $304M to Kansas-based OSAT Integra Technologies t... » read more

Week in Review: Design, Low Power


Intel discontinued its Pathfinder for RISC-V program, according to numerous reports. The program provided a pre-silicon development environment to support IP selection and early-stage software development using Intel FPGA and simulator platforms. "Since Intel will not be providing any additional releases or bug fixes, we encourage you to promptly transition to third-party RISC-V software tools ... » read more

Building Better Cars Faster


Carmakers are accelerating their chip and electronic design schedules to remain competitive in an increasingly fast-changing market, but they are encountering gaps in the tooling, the supply chain, and in the methodologies they use to create those cars. While it's easy to envision how CAD software could be used to create the next new vehicle’s 3-D look, and how simulation software helps de... » read more

Leveraging The Benefits Of A FIPS 140 CMVP Certified Root Of Trust IP


Expectations that security IP designs meet the highest security standards are growing rapidly. As companies face increased product development costs and time pressure, choosing an IP that has been certified demonstrates not just compliance with a standard, but offers a valuable tool to reducing overall project risk. The Federal Information Processing Standard (FIPS) 140 is published by NIST,... » read more

Solving Problems With The IoT


The Internet of Things, a term once applied to almost any "smart" gadget connected to the Internet, is becoming more useful, more complex, and more of a security risk as the value of data continues to grow and more people depend on IoT technology. In the decades since the concept was first introduced, IoT devices have become so ubiquitous that applications cover practically every consumer, c... » read more

Improving Performance And Power With HBM3


HBM3 swings open the door to significantly faster data movement between memory and processors, reducing the power it takes to send and receive signals and boosting the performance of systems where high data throughput is required. But using this memory is expensive and complicated, and that likely will continue to be the case in the short term. High Bandwidth Memory 3 (HBM3) is the most rece... » read more

Choosing The Correct High-Bandwidth Memory


The number of options for how to build high-performance chips is growing, but the choices for attached memory have barely budged. To achieve maximum performance in automotive, consumer, and hyperscale computing, the choices come down to one or more flavors of DRAM, and the biggest tradeoff is cost versus speed. DRAM remains an essential component in any of these architectures, despite years ... » read more

PCIe 6.0 Takes Data Center Performance To The Next Level


Looking back at 2022, we saw a major update to the PCI Express (PCIe) specification. PCIe 6.0 brought with it some of the most fundamental changes yet seen by the specification, resulting in some exciting capabilities that are set to take data center performance to the next level in the years ahead. PCIe has been the interconnect of choice in computing for two decades now. Its ongoing advanc... » read more

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