tag: Rambus

MIPI DSI-2 & VESA Video Compression Enable Next-Generation Displays
By Joseph Rodriguez - 09 Feb, 2023 - Comments: 0

By Joseph Rodriguez and Simon Bussières It is hard to believe, but it has been 20 years since MIPI Alliance was first founded. The organization was originally formed to standardize the video interface technologies for cameras and displays in phones, with the MIPI acronym standing for Mobile Industry Processor Interface (MIPI). As the mobile industry has evolved, MIPI Alliance has evolved wi... » read more

Disaggregating And Extending Operating Systems
By Karen Heyman - 09 Feb, 2023 - Comments: 0

The push toward disaggregation and customization in hardware is starting to be mirrored on the software side, where operating systems are becoming smaller and more targeted, supplemented with additional software that can be optimized for different functions. There are two main causes for this shift. The first is rising demand for highly optimized and increasingly heterogeneous designs, which... » read more

Chiplets Taking Root As Silicon-Proven Hard IP
By Ann Mutschler - 09 Feb, 2023 - Comments: 0

Chiplets are all the rage today, and for good reason. With the various ways to design a semiconductor-based system today, IP reuse via chiplets appears to be an effective and feasible solution, and a potentially low-cost alternative to shrinking everything to the latest process node. To enable faster time to market, common IP or technology that already has been silicon-proven can be utilized... » read more

Blog Review: Feb. 8
By Jesse Allen - 08 Feb, 2023 - Comments: 0

Cadence's Sanjeet Kumar points to key changes and optimizations that are done for USB3 Gen T compared to USB3 Gen X tunneling in order to minimize tunnel overhead and maximize USB3 throughput. Siemens EDA's Harry Foster considers the effectiveness of IC and ASIC verification by looking at schedule overruns, number of required spins, and classification of functional bugs. Synopsys' Chris C... » read more

Where Power Is Spent In HBM
By Ed Sperling - 06 Feb, 2023 - Comments: 0

HBM is gaining ground because of a spike in the amount of data that needs to be processed quickly, but big reductions in power are possible if that processing can be moved closer to the HBM modules, and if more can be done in each compute cycle without sending data back and forth to memory as frequently. Steven Woo, fellow and distinguished engineer at Rambus, talks about what can be done to bo... » read more

Chip Industry’s Earnings Roundup
By Linda Christensen - 06 Feb, 2023 - Comments: 0

Editor's Note: Updated throughout February 2023 for additional earnings releases. Many companies reported revenue growth in the most recent quarter, but the latest round of chip industry earnings releases reflected some major themes: Demand for consumer electronics softened due to inflation, rising interest rates, and post-pandemic market saturation, creating a slump in the memory chip ... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 03 Feb, 2023 - Comments: 0

The United States Justice of Department asked Tesla for documents relating to its Autopilot driver assistance system and its Full Self-Driving (FSD). Among other tech company woes, some of which are leading to layoffs, Apple sales dropped 5% year over year and it missed its earnings target this quarter. The U.S. state of Kansas will commit $304M to Kansas-based OSAT Integra Technologies t... » read more

Week in Review: Design, Low Power
By Jesse Allen - 03 Feb, 2023 - Comments: 0

Intel discontinued its Pathfinder for RISC-V program, according to numerous reports. The program provided a pre-silicon development environment to support IP selection and early-stage software development using Intel FPGA and simulator platforms. "Since Intel will not be providing any additional releases or bug fixes, we encourage you to promptly transition to third-party RISC-V software tools ... » read more

Building Better Cars Faster
By John Koon - 02 Feb, 2023 - Comments: 0

Carmakers are accelerating their chip and electronic design schedules to remain competitive in an increasingly fast-changing market, but they are encountering gaps in the tooling, the supply chain, and in the methodologies they use to create those cars. While it's easy to envision how CAD software could be used to create the next new vehicle’s 3-D look, and how simulation software helps de... » read more

Leveraging The Benefits Of A FIPS 140 CMVP Certified Root Of Trust IP
By Bart Stevens - 02 Feb, 2023 - Comments: 0

Expectations that security IP designs meet the highest security standards are growing rapidly. As companies face increased product development costs and time pressure, choosing an IP that has been certified demonstrates not just compliance with a standard, but offers a valuable tool to reducing overall project risk. The Federal Information Processing Standard (FIPS) 140 is published by NIST,... » read more

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