Using AI To Speed Up Edge Computing


AI is being designed into a growing number of chips and systems at the edge, where it is being used to speed up the processing of massive amounts of data, and to reduce power by partitioning and prioritization. That, in turn, allows systems to act upon that data more rapidly. Processing data at the edge rather than in the cloud provides a number of well-documented benefits. Because the physi... » read more

Designing Immersive AR/VR Displays


Last month, we looked at how VESA (Video Electronics Standards Association) video compression codecs enable cutting-edge displays. Over the next couple of articles, we will take a closer look at some of the markets where VESA DSC (Display Stream Compression) and VDC-M (VESA Display Compression) compression offer significant benefits for designers working on display-based applications. Demand... » read more

Post Quantum Cryptography Is Coming


Quantum computing has made big advances in recent years and experts agree that quantum computers capable of breaking 2048-bit RSA or 256-bit ECC will be built — it’s just a matter of time. In this white paper, we discuss the security algorithms NIST has selected for Post Quantum Cryptography (PQC) and their instantiation in Rambus security products. Download this white paper to learn: ... » read more

Blog Review: July 13


Siemens' John Sturtevant finds that the patterning requirements of next generation lithographic processes have pushed lithographers to explore the advantages of curvilinear masks, and notes some of the tools coming along to help. Cadence's Paul McLellan learns from Kyle Chen of Microsoft and Suomin Cui of Cadence how deep learning and electromagnetic solvers can be used to optimize high-dens... » read more

Implementing Memory Encryption To Protect Data In Use


In my blog “The Methods of Memory Encryption to Protect Data in Use,” I discussed how the XTS/XEX mode of encryption was the appropriate choice for protecting data stored in and accessed from memory, also known as, protecting data in use. As a quick recap, XTS/XEX uses two keys, one key for block encryption, and another key to process a “tweak.” The tweak ensures every block of memory i... » read more

Security Risks Widen With Commercial Chiplets


The commercialization of chiplets is expected to increase the number and breadth of attack surfaces in electronic systems, making it harder to keep track of all the hardened IP jammed into a package and to verify its authenticity and robustness against hackers. Until now this has been largely a non-issue, because the only companies using chiplets today — AMD, Intel, and Marvell — interna... » read more

Blog Review: June 15


Ansys' Vidyu Challa considers common primary, or single-use, battery chemistries and how they affect that many important cell properties, such as energy density, flammability and safety, available cell constructions, temperature range, and shelf life. Synopsys' Rimpy Chugh and Rohit Kumar Ohlayan discuss some of the challenges arising from static linting of code, shifting linting left in the... » read more

Chips Can Boost Malware Immunity


Security is becoming an increasingly important design element, fueled by increasingly sophisticated attacks, the growing use of technology in safety-critical applications, and the rising value of data nearly everywhere. Hackers can unlock automobiles, phones, and smart locks by exploiting system design soft spots. They even can hack some mobile phones through always-on circuits when they are... » read more

Video Compression Enables Cutting-Edge Displays


Display technology has advanced in leaps and bounds. We can now create professional-quality video content on our mobiles, and our cars often have more displays than our living room. In recent years, electronics manufacturers have been using increasingly sophisticated display feature sets as a way of differentiating their products in the highly competitive consumer electronics market. Each new g... » read more

DRAM Thermal Issues Reach Crisis Point


Within the DRAM world, thermal issues are at a crisis point. At 14nm and below, and in the most advanced packaging schemes, an entirely new metric may be needed to address the multiplier effect of how thermal density increasingly turns minor issues into major problems. A few overheated transistors may not greatly affect reliability, but the heat generated from a few billion transistors does.... » read more

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