Reliability, Machine Learning And Advanced Packaging


Semiconductor Engineering sat down to discuss reliability, resilience, machine learning and advanced packaging with Rahul Goyal, vice president in the technology and manufacturing group at Intel; Rob Aitken, R&D fellow at Arm; John Lee, vice president and general manager of the semiconductor business unit at ANSYS; and Lluis Paris, director of IP portfolio marketing at TSMC. What follows ar... » read more

Why Test Costs Will Increase


The economics of test are under siege. Long seen as a necessary but rather mundane step in ensuring chip quality, or a way of testing circuitry from the inside while it is still in use, manufacturers and design teams have paid little attention to this part of the design-through-manufacturing flow. But problems have been building for some time in three separate areas, and they could have a b... » read more

Adding Safety Into Automotive Design


The ISO 26262 spec is a household term for anyone even remotely involved with the automotive industry today. Increasingly, though, it is being used interchangeably with safety-readiness across the entire supply chain. ISO 26262 compliance is a prerequisite for IP and chips used in an increasing number of automotive applications. It applies to systems, software, and to individual products. An... » read more

Data Converters For Automotive Applications


Sensor applications requiring data converters range from temperature sensors identifying different engine status to radar/LIDAR enabling Automotive Driver Assistance Systems (ADAS). Other applications involving data converters include wireless transceivers for communicating with other vehicles or with a fixed network. The data converter IP (analog-to-digital and digital-to-analog) provides an i... » read more

Aging In Advanced Nodes


Semiconductor Engineering sat down to discuss design reliability and circuit aging with João Geada, chief technologist for the semiconductor business unit at ANSYS; Hany Elhak, product management director, simulation and characterization in the custom IC and PCB group at Cadence; Christoph Sohrmann, advanced physical verification at Fraunhofer EAS; Magdy Abadir, vice president of marketing at ... » read more

Mission Profiles


In the field of electronic systems, the mission profile has been one of the key concepts since the start of the scientific examination of the subject of reliability. Its exact meaning varies with time and the industry using it. In particular, over the course of increasing digitalization and networking in the context of IoT and the opportunities resulting from this, the subject of mission profil... » read more

5 Reasons Why In-Chip Monitoring Is Here To Stay


When the first car rolled off his production line in 1913, Henry Ford would have already envisioned just how prolific the automobile would become. However, would he have foreseen the extent to which monitors and sensors would become critical to the modern internal combustion engine? The requirement for energy efficiency, power performance and reliability in high volume manufactured vehicles ... » read more

Process Corner Explosion


The number of corners that need to be checked is exploding at 7nm and below, fueled by everything from temperature and voltage to changes in metal. Lowering risk and increasing predictability of an SoC at those nodes starts with understanding what will happen when a design is manufactured on a particular foundry process, captured in process corners. This is basically a way of modeling what i... » read more

Cracking The Auto IC Market


The market for automotive electronics is booming, and it has set off a global scramble among established chipmakers and startups. What's becoming clear, though, is that not everyone understands just how different automotive is from the mobile market. Mobile is still the highest-volume market for semiconductors, but the growth has flattened. In contrast, the value of the automotive electronic... » read more

The Rising Cost Of 5G


Semiconductor Engineering sat down to talk about challenges and progress in 5G with Yorgos Koutsoyannopoulos, president and CEO of Helic; Mike Fitton, senior director of strategic planning and business development at Achronix; Sarah Yost, senior product marketing manager at National Instruments; and Arvind Vel, director of product management at ANSYS. What follows are excerpts of that conversat... » read more

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