Week In Review: Semiconductor Manufacturing, Test


Japanese and American trade officials announced a joint roadmap for cooperation in strengthening global semiconductor supply chains by advancing Japan-U.S. collaboration with emerging and developing countries in the Indo-Pacific. China and South Korea agreed to strengthen dialogue and cooperation on semiconductor industry supply chains with a focus on the supply of key raw materials and ensu... » read more

Week In Review: Auto, Security, Pervasive Computing


AI predictions and announcements filled the news this week, including a statement from the Center for AI Safety that was signed by some top AI execs — including Sam Altman, CEO of OpenAI — warning that uncontrolled AI could end up smarter than us and lead to our extinction. Foxconn estimates its artificial intelligence server revenue will double this year with the popularity of generative A... » read more

Blog Review: May 31


Cadence's Moshik Rubin looks at how the Portable Test and Stimulus Standard (PSS) is finding new use cases in ATE production test by enabling creation of a rich set of functional test scenarios in a reusable way. Synopsys' LJ Chen and Dana Neustadter check out the latest version of the Universal Flash Storage (UFS) standard, which doubles the data transfer rate of the preceding UFS 3.1 solut... » read more

Connectivity Challenges In Industry 4.0


Industry 4.0 is characterized by interoperability (such as IIoT), information transparency (digital plant models: virtual copy of physical world), technical support (the ability of cyber-physical systems to support humans by executing various tasks), and decentralized decision-making. IIoT allows devices to be connected, creating a virtual copy of real-world data that allows operators to visual... » read more

Blog Review: May 24


Siemens' Patrick McGoff finds that designers have not had easy tools to address solderability, leaving a critical part of the manufacturing success of a PCB to the component engineer or the contract manufacturer, and points to manufacturing-driven design as a way to avoid quality issues later. Cadence's Rich Chang finds that effective UPF low-power verification and debug involves more than o... » read more

Smallest Thinnest Power Modules For Data Center Optical Modules


Data transmission rates in optical communication field are on a constant rise. This paper describes the ever-increasing demand for highly integrated, small form factor, low profile yet thermally superior and electrically efficient power supply solution to support these high data rates and large amount of data transfer. It then follows to highlight Renesas’s best in class mini power mo... » read more

Blog Review: May 17


Synopsys' Dana Neustadter examines the key industries driving Ethernet security, challenges to securing Ethernet networks, and the MACsec protocol that guards against network data breaches by encrypting data traffic between Ethernet-connected devices. Siemens' Stephen Chavez points to the improvements gained from design reuse in PCB design but warns that inefficient processes for managing an... » read more

Blog Review: May 10


Synopsys' Alessandra Nardi and Uyen Tran explain how to meet quality, reliability, functional safety, and security requirements of automotive chips through thorough test programs, path-margin monitoring, and design failure mode and effect analysis (DFMEA). Cadence's Veena Parthan explores how computational fluid dynamics can help predict and model the generation, propagation, and mitigation ... » read more

Role Of IoT Software Expanding


IoT software is becoming much more sophisticated and complex as vendors seek to optimize it for specific applications, and far more essential for vendors looking to deliver devices on-time and on-budget across multiple market segments. That complexity varies widely across the IoT. For example, the sensor monitoring for a simple sprinkler system is far different than the preventive maintenanc... » read more

Week In Review: Auto, Security, Pervasive Computing


Pervasive computing Renesas introduced a narrowband Internet of Things (NB-IoT) chipset and dev kit for the Indian market. The LTE NB-IoT modem chipset, the RH1NS200, was designed for Indian telecommunications carriers by targeting bands 1,3, 5 and 8 and by following India’s carrier-approved LTE protocol stack and software suite. Low power usage is built in — it has a low Power Saving Mode... » read more

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