tag: RF

Mixed Outlook For Silicon Wafers
By Mark LaPedus - 20 Jan, 2022 - Comments: 0

Silicon wafers are a fundamental part of the semiconductor business. Every chipmaker needs to buy them in one size or another, such as 200mm, 300mm and others. Silicon wafer vendors produce and sell bare or raw silicon wafers to chipmakers, who in turn process them into chips. So what’s in store for the silicon wafer market? Sungho Yoon, senior research manager at SEMI, sat down with Se... » read more

Revving Up SiC And GaN
By Ann Mutschler - 13 Dec, 2021 - Comments: 0

Silicon carbide (SiC) and gallium nitride (GaN) are becoming more popular for power electronics, particularly in automotive applications, driving down costs as volumes scale up and increasing the demand for better tools to design, verify, and test these wide-bandgap devices. Both SiC and GaN are proving essential in areas such as battery management in electric vehicles. They can handle much ... » read more

The 5G Rollout: Solving Advanced RF Metrology Challenges
By Johnny Dai - 07 Dec, 2021 - Comments: 0

The global radio frequency (RF) semiconductor market size is growing rapidly at a compound annual growth rate of 8.5%, with an expected increase from $17.4 billion in 2020 to $26.2 billion in 2025, according to Research and Markets [1]. As many are aware, the rollout of 5G technology and the Internet of Things (IoT), which is enabled by 5G, are the main driving forces for this growth. Growth... » read more

Coping With Parallel Test Site-to-Site Variation
By Anne Meixner - 09 Nov, 2021 - Comments: 1

Testing multiple devices in parallel using the same ATE results in reduced test time and lower costs, but it requires engineering finesse to make it so. Minimizing test measurement variation for each device under test (DUT) is a multi-physics problem, and it's one that is becoming more essential to resolve at each new process node and in multi-chip packages. It requires synchronization of el... » read more

RF/Microwave Technology Driving The Connected Car
By Cadence - 03 Nov, 2021 - Comments: 0

In-car networks and advanced driver-assistance systems (ADAS), made possible through wireless sensors, driver-assist radar, vehicle communications, and related electronics, present many design challenges to engineers. Simulation software enables design teams to effectively manage the complex design and integration challenges associated with developing these high-speed and RF-enabled networks. T... » read more

3D Printing For More Circuits
By Ann R. Thryft - 27 Oct, 2021 - Comments: 0

After several years of experimentation, and growing success in volume manufacturing for some use cases, technologies for 3D printing of electronic circuits are becoming more common. Some innovations in processes and materials are moving these technologies closer to mainstream electronics manufacturing. Christopher Tuck, professor of material science at the University of Nottingham, observed ... » read more

Challenges In RF Design
By Roland Jancke - 14 Oct, 2021 - Comments: 0

Designing highly integrated components for radio frequency applications poses special challenges for system engineers, designers and the commissioning engineers. The boundary between chip, package and board is increasingly vanishing on modern components. It is growing more common for parts of the functionality to be moved to the package or even the board. In some cases, the requirements have be... » read more

System-In-Package Thrives In The Shadows
By Mark LaPedus - 16 Sep, 2021 - Comments: 0

IC packaging continues to play a big role in the development of new electronic products, particularly with system-in-package (SiP), a successful approach that continues to gain momentum — but mostly under the radar because it adds a competitive edge. With a SiP, several chips and other components are integrated into a package, enabling it to function as an electronic system or sub-system. ... » read more

Specialty Technologies Bring New Functionality
By David Haynes - 19 Aug, 2021 - Comments: 0

As a materials engineer, I am very proud of the fact that key advances in human civilization have been driven by materials innovation. The stone age, bronze age, and iron age were all essential steps in setting the human race on the path that we are on today. Innovations are not without their downsides, but they have enabled progress in agriculture, medicine, transportation, communication, a... » read more

Empowering RF Front End Cellular Innovations With DSMBGA
By Curtis Zwenger - 19 Aug, 2021 - Comments: 0

With the introduction of 5G, cellular frequency bands have increased considerably, requiring innovative solutions for the packaging of RF front-end modules for smartphones and other 5G-enabled devices. Double-sided, molded ball grid array (DSMBGA) is a prime example of such solutions. “With our DSMBGA platform, we’ve established a preferred advanced packaging solution for this domain,”... » read more

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