tag: Sandia National Labs

Research Bits: May 13
By Jesse Allen - 13 May, 2025 - Comments: 0

Benchmarking 3D-IC cooling Researchers from Massachusetts Institute of Technology (MIT) and HRL Laboratories developed a specialized chip to test and validate cooling solutions for packaged chip stacks. The chip dissipates extremely high power, generating heat through the silicon layer and in localized hot spots to mimic high-performance logic chips. It then uses diodes to measure temperatu... » read more

Chip Industry Week in Review
By The SE Staff - 25 Apr, 2025 - Comments: 0

To listen to the podcast version, click here. TSMC unveiled an unusually detailed roadmap at this week's North America Technology Symposium, including future architectures for 3D-ICs for high-performance computing and small, extremely low-power chips for AR/VR glasses, and two implementations of system-on-wafer. Fig. 1: TSMC's future packaging and stacking roadmap. Source: TSMC The ... » read more

Chip Industry Week In Review
By The SE Staff - 11 Apr, 2025 - Comments: 0

Don't have time to read this? Check out Semiconductor Engineering's Inside Chips podcast.  The U.S. Department of Commerce is investigating TSMC for potential export control violations involving Huawei chips, reports Reuters. The probe follows TechInsights' teardown of a Huawei AI accelerator chip last year. The foundry, meanwhile, maintains it has not shipped any chips to Huawei since 2020... » read more

Chip Industry Technical Paper Roundup: Dec. 23
By Linda Christensen - 23 Dec, 2024 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=394 /] Find all technical papers here. » read more

Chip Industry Week In Review
By The SE Staff - 11 Oct, 2024 - Comments: 0

Imec announced a new automotive chiplet consortium to evaluate which different architectures and packaging technologies are best for automotive applications. Initial members includes Arm, ASE, Cadence, Siemens, Synopsys, Bosch, BMW, Tenstorrent, Valeo, and SiliconAuto. Imec also launched star, a global network bringing together automotive and semiconductor innovators to address technological c... » read more

Chip Industry’s Technical Paper Roundup: Nov. 21
By Linda Christensen - 21 Nov, 2022 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=65 /] » read more

Stabilizing A Hafnium Oxide-Based Thin Film When Sandwiched Between A Metal Substrate And An Electrode
By Technical Paper Link - 17 Nov, 2022 - Comments: 0

A technical paper titled "Origin of Ferroelectric Phase Stabilization via the Clamping Effect in Ferroelectric Hafnium Zirconium Oxide Thin Films" was published by researchers at University of Virginia, Brown University, Sandia National Labs, and Oak Ridge National Lab. Funding was given by U.S. DOE's 3D Ferroelectric Microelectronics Energy Frontier Research Center and the SRC. "This study ... » read more

Chip Industry’s Technical Paper Roundup: Oct 18
By Linda Christensen - 18 Oct, 2022 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=57 /] » read more

Transistor-Free Compute-In-Memory Architecture
By Technical Paper Link - 11 Oct, 2022 - Comments: 0

A new technical paper titled "Reconfigurable Compute-In-Memory on Field-Programmable Ferroelectric Diodes" was recently published by researchers at University of Pennsylvania, Sandia National Labs, and Brookhaven National Lab. The compute-in-memory design is different as it is completely transistor-free. “Even when used in a compute-in-memory architecture, transistors compromise the access... » read more

The Race To Make Better Qubits
By Katherine Derbyshire - 18 Nov, 2021 - Comments: 0

One of the big challenges in quantum computing is getting qubits to last long enough to do something useful with them. After decades of research, there now appears to be tangible progress. The challenge with any new semiconductor technology is to improve performance by one or more orders of magnitude without discarding a half-century of progress in other areas. Qubits based on silicon quantu... » read more

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