Machine Learning For IC Production

By Mark LaPedus - 16 Jan, 2019 - Comments: 0

Semiconductor Engineering sat down to discuss artificial intelligence (AI), machine learning, and chip and photomask manufacturing technologies with Aki Fujimura, chief executive of D2S; Jerry Chen, business and ecosystem development manager at Nvidia; Noriaki Nakayamada, senior technologist at NuFlare; and Mikael Wahlsten, director and product area manager at Mycronic. What follows are excerpt... » read more

Blog Review: Jan. 16

By Jesse Allen - 16 Jan, 2019 - Comments: 0

Mentor's Harry Foster takes a look at how quickly FPGAs are adopting recent verification techniques, with formal gaining at a rapid pace. Cadence's Paul McLellan checks out the details of two new RISC-V based cores: Western Digital's open source SweRV and Esperanto's Maxion. Synopsys' Taylor Armerding digs into a recent cybersecurity report from the U.S. government and finds a troubling n... » read more

Top Tech Talks Of 2018

By Linda Christensen - 31 Dec, 2018 - Comments: 0

2018 shaped up to be a year of transition and inflection, sometimes in the same design. There were new opportunities in automotive, continued difficulties in scaling, and an explosion in AI and machine learning everywhere. Traffic numbers on stories give a snapshot of the most current trends, but with videos those trends are even more apparent because of the time invested in watching those v... » read more

Week In Review: Manufacturing, Test

By Mark LaPedus - 28 Dec, 2018 - Comments: 0

Tariffs The United States and China are in the midst of a trade war. New data shows that tariffs on imported Chinese products now cost the technology industry an additional $1 billion per month, according to the Consumer Technology Association (CTA). Nearly 70% of tariffs paid by the hi-tech industry come from the $200 billion product list enacted Sep. 24. Tariffs on CTA-identified tech pro... » read more

Interest Grows In Ferroelectric Devices

By Katherine Derbyshire - 27 Dec, 2018 - Comments: 0

Ferroelectric FETs and memories are beginning to show promise as researchers begin developing and testing next-generation transistors. One measure of the efficiency of a transistor is the subthreshold swing, which is the change in gate voltage needed to increase the drain current by one order of magnitude. Measured in units of millivolts per decade, in conventional MOSFETs it is limited to k... » read more

Fundamental Shifts In 2018

By Brian Bailey - 20 Dec, 2018 - Comments: 1

What surprised the industry in 2018? While business has been strong, markets are changing, product categories are shifting and clouds are forming on the horizon. As 2018 comes to a close, most companies are pretty happy with the way everything turned out. Business has been booming, new product categories developing, and profits are meeting or beating market expectations. "2018 was indeed a... » read more

5 Observations From Intel’s Event

By Mark LaPedus - 17 Dec, 2018 - Comments: 0

Not long ago, Intel hosted its “Architecture Day,” where top executives from the chip giant revealed the company’s latest products and next-generation technologies. The company also discussed its strategy. To be sure, it’s a critical time for Intel. In June, Brian Krzanich was forced out as chief executive and the company is still looking for a permanent CEO. Plus, Intel has delayed it... » read more

What’s A Mott FET?

By Katherine Derbyshire - 17 Dec, 2018 - Comments: 0

The unique physics of two-dimensional semiconductors offers the potential for new kinds of switches that could extend the usefulness of conventional MOSFETs into a variety of new areas. A MOSFET applies a voltage to one side of the gate capacitor. The resulting electric field in the channel shifts the band structure and facilitates or impedes the flow of carriers. So as devices shrink, the g... » read more

A New Approach to Metrology

By Jeff Dorsch - 14 Dec, 2018 - Comments: 0

The startup Active Layer Parametrics Inc.'s ALPro 50 metrology tool offers “depth profiling of electrical properties at atomic-level resolution” —and automated processing with direct data transfer. The continuing miniaturization of microchips and nanochips has propelled the use of atomic-layer deposition and atomic-layer etch processes in semiconductor manufacturing. With miniaturization... » read more

← Older posts Newer posts →

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.