Next Steps For Panel-Level Packaging

By Mark LaPedus - 20 Dec, 2021 - Comments: 1

Tanja Braun, group manager at Fraunhofer Institute for Reliability and Microintegration (IZM), sat down with Semiconductor Engineering to talk about III-V device packaging, chiplets, fan-out and panel-level processing. Fraunhofer IZM recently announced a new phase of its panel-level packaging consortium. What follows are excerpts of that discussion. SE: IC packaging isn’t new, but years a... » read more

Six Examples Of Predictive Maintenance

By Jessica Albright - 16 Dec, 2021 - Comments: 0

One of the many tools that condition monitoring enables us to provide is predictive maintenance. Predictive maintenance allows you to improve business efficiency by minimizing downtime and increasing productivity. This is achieved by strategically monitoring assets and conditions specific to your business, which vary significantly based on your industry. While several companies directly be... » read more

Power/Performance Bits: Dec. 14

By Jesse Allen - 14 Dec, 2021 - Comments: 0

Improved digital sensing Researchers from Imperial College London and Technical University of Munich propose a technique to improve the capability of many different types of sensors. The method addresses voltage limits in analog-to-digital converters and the saturation that results in poor quality when an incoming signal exceeds those limits. “Our new technique lets us capture a fuller ra... » read more

Choose The Right Sensors For Autonomous Vehicles

By Kara Gremillion - 09 Dec, 2021 - Comments: 0

When the world’s first “motorwagen” was introduced in 1885, the notion that a car would one day drive itself was laughable. Today, assisted and autonomous vehicles are the reality of an age where digital sensors can outperform human ability to perceive motion, distance, and speed. When used together, sensor technologies including camera, lidar, radar, and ultrasonic give vehicles one... » read more

Innovations In Sensor Technology

By John Koon - 09 Dec, 2021 - Comments: 0

Sensors are the “eyes” and “ears” of processors, co-processors, and computing modules. They come in all shapes, forms, and functions, and they are being deployed in a rapidly growing number of applications — from edge computing and IoT, to smart cities, smart manufacturing, hospitals, industrial, machine learning, and automotive. Each of these use cases relies on chips to capture d... » read more

Big Changes Ahead For Inside Auto Cabins

By Bryon Moyer - 08 Dec, 2021 - Comments: 0

The space we occupy inside our vehicles is poised to change from mere enclosure to participant in the driving experience. Whether for safety or for comfort, a wide range of sensors are likely to appear that will monitor the “contents” of the vehicle. The overall approach is referred to as an in-cabin monitoring system (ICMS), but the specific applications vary widely. “In-cabin sensing... » read more

A DSP For Implementing High-Performance Sensor Fusion On An Embedded Budget

By Markus Willems - 11 Nov, 2021 - Comments: 0

By Markus Willems and Pieter van der Wolf Sensor fusion refers to the combining of data from multiple sensors to obtain more complete and accurate results. By using the information provided by multiple sensing devices, it is possible to achieve better context awareness. Smart mobile devices, autonomous driving, smart home appliances, industrial control, and robotics are just a few of the app... » read more

Uniform Spin Qubit Devices with Tunable Coupling in an All-Silicon 300 mm Integrated Process

By Technical Paper Link - 26 Oct, 2021 - Comments: 0

Abstract: Larger arrays of electron spin qubits require radical improvements in fabrication and device uniformity. Here we demonstrate excellent qubit device uniformity and tunability from 300K down to mK temperatures. This is achieved, for the first time, by integrating an overlapping polycrystalline silicon-based gate stack in an ‘all-Silicon’ and lithographically flexible 300mm flow. ... » read more

Reaching silicon-based NEMS performances with 3D printed nanomechanical resonators

By Technical Paper Link - 19 Oct, 2021 - Comments: 0

Abstract: "The extreme miniaturization in NEMS resonators offers the possibility to reach an unprecedented resolution in high-performance mass sensing. These very low limits of detection are related to the combination of two factors: a small resonator mass and a high quality factor. The main drawback of NEMS is represented by the highly complex, multi-steps, and expensive fabrication process... » read more

Effect Of Environmental Factors On ADAS Sensor Performance (AAA)

By Technical Paper Link - 19 Oct, 2021 - Comments: 0

Abstract "Advanced driver assistance systems (ADAS) are becoming increasingly integrated within new vehicles sold in the United States. However, the majority of publicly available performance evaluations occur within idealized operation conditions in terms of weather, time of day, and sensor status, which are typically unrepresentative of naturalistic environments. To evaluate the performa... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: sensors