tag: Siemens EDA

New Uses For AI In Chips
By John Koon and Ed Sperling - 11 Aug, 2022 - Comments: 1

Artificial intelligence is being deployed across a number of new applications, from improving performance and reducing power in a wide range of end devices to spotting irregularities in data movement for security reasons. While most people are familiar with using machine learning and deep learning to distinguish between cats and dogs, emerging applications show how this capability can be use... » read more

Verifying A DDR5 Memory Subsystem
By Siemens EDA - 10 Aug, 2022 - Comments: 0

With the increasing complexity of DDR memory models and a vast set of configurations, it has become a daunting experience for verification engineers to verify memory subsystems. With the help of DDR5 Questa VIP and its unique features, engineers can maximize their debugging capabilities and achieve their verification goals quickly and efficiently. This paper introduces the Siemens EDA DDR5 and ... » read more

Design And Security Challenges for VR
By John Koon - 10 Aug, 2022 - Comments: 0

Virtual reality is no longer just for gamers, and as this technology is deployed in everything from health care to industrial training, the requirements for processing more data faster over a high-speed connection are growing. Designing these devices continues to be a study in contradictions. They must be extremely low power, with a small enough batteries to make them comfortable to wear. Bu... » read more

Blog Review: Aug. 10
By Jesse Allen - 10 Aug, 2022 - Comments: 0

Siemens' Heather George provides a primer on 3D IC, including the problems it is trying to solve, what differentiates it from other multi-chip technologies, and some of the unique challenges in 3D integration. Cadence's Paul McLellan shares highlights from the Automobil Elektronik Kongress, including how the increasing amount of software in a car is driving disruption in the automotive suppl... » read more

Leaning Into The SoC Power Methodology
By Amir Attarha - 04 Aug, 2022 - Comments: 0

As inflation skyrockets and the price of everything increases seemingly by the hour, finding ways to trim time and costs are more valuable than ever. Lean manufacturing was introduced by the Toyota Motor Corporation almost 100 years ago, laying the framework for future generations of manufacturing and industrial settings. Lean manufacturing is a methodology that focuses on minimizing waste w... » read more

Chip Backdoors: Assessing the Threat
By Jeff Goldman - 04 Aug, 2022 - Comments: 0

In 2018, Bloomberg Businessweek made an explosive claim: Chinese spies had implanted backdoors in motherboards used by some high-profile customers, including the U.S. Department of Defense. All of those customers issued strongly worded denials. Most reports of hardware backdoors have ended up in exchanges like these. There are allegations and counter-allegations about specifics. But as hardw... » read more

Is Standardization Required For Security?
By Ann Mutschler - 04 Aug, 2022 - Comments: 1

Semiconductor Engineering sat down to discuss chip and system security with Mike Borza, fellow and scientist on the security IP team at Synopsys; Lee Harrison, automotive IC test solutions manager at Siemens Digital Industries Software; Jason Oberg, founder and CTO of Cycuity (formerly Tortuga Logic); Nicole Fern, senior security analyst at Riscure; Norman Chang, fellow and CTO of the electroni... » read more

Blog Review: Aug. 3
By Jesse Allen - 03 Aug, 2022 - Comments: 0

Siemens' Patrick Hope explains the growing importance of choosing the right laminate for PCB designs and how to read a material datasheet to compare important electrical, thermal, and mechanical properties. Synopsys' Yankin Tanurhan argues that as the number of sensors being integrated in automotive systems increases to enable new ADAS and autonomy capabilities, building security and quality... » read more

Using ML Methods In Production-Ready Engineering Solutions For IC Verification
By WeiLii Tan - 02 Aug, 2022 - Comments: 0

By WeiLii Tan & Jeff Dyck Semiconductor designs continue to push the envelope of performance, functionality, and efficiency while their application scope expands in high-performance computing, automotive solutions, and IoT devices. The increased design complexity, scale, and mission-critical operations of semiconductor designs mean that IC verification strategies must evolve to cover expon... » read more

2.5/3D IC Reliability Verification Has Come A Long Way
By Dina Medhat - 01 Aug, 2022 - Comments: 0

2.5D/3D integrated circuits (ICs) have evolved into an innovative solution for many IC design and integration challenges. As shown in figure 1, 2.5D ICs have multiple dies placed side-by-side on a passive silicon interposer. The interposer is placed on a ball grid array (BGA) organic substrate. Micro-bumps attach each die to the interposer, and flip-chip (C4) bumps attach the interposer to the ... » read more

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