tag: Siemens EDA

Comparing Formal And Simulation Code Coverage
By Siemens EDA - 09 Mar, 2022 - Comments: 0

There is a difference in semantics between code coverage generated from a simulator engine and code coverage generated from a formal engine. This paper seeks to raise the awareness of verification engineers on how best to make use of the code coverage data generated by different verification engines. The paper lays out the reasons for using code coverage and describes how simulation code covera... » read more

Navigating The Intersection Of Safety And Security
By Siemens EDA - 09 Mar, 2022 - Comments: 0

Vehicle systems and the semiconductors used within them are some of the most complex electronics seen today. In the past, electronics going into vehicle systems implemented flat architectures with isolated functions controlling various components of the power train and vehicle dynamics. However, to support the realization of Level 4 and Level 5 (L4/L5) autonomous driving, a massive restructure ... » read more

Enabling Silicon Lifecycle Solutions
By Aileen Ryan - 08 Mar, 2022 - Comments: 0

The concepts of product lifecycle management (PLM) should be familiar, although the semiconductor industry has yet to adopt a system for managing the entire lifecycle of a product from inception through design, realization, deployment, and field service, right through to end-of-life activities such as final disposal. Now, a combination of business and technical pressures is bringing PLM capabil... » read more

Verifying Side-Channel Security Pre-Silicon
By Bryon Moyer - 03 Mar, 2022 - Comments: 1

As security grows in importance, side-channel attacks pose a unique challenge because they rely on physical phenomena that aren’t always modeled for the design verification process. While everything can be hacked, the goal is to make it so difficult that an attacker concludes it isn't worth the effort. For side-channel attacks, the pre-silicon design is the best place to address any known ... » read more

Machine Learning Showing Up As Silicon IP
By Bryon Moyer - 03 Mar, 2022 - Comments: 0

New machine-learning (ML) architectures continue to appear. Up to now, each new offering has been implemented in a chip for sale, to be placed alongside host processors, memory, and other chips on an accelerator board. But over time, more of this technology could be sold as IP that can be integrated into a system-on-chip (SoC). That trend is evident at recent conferences, where an increasing... » read more

Manufacturing Cyber Security
By Siemens EDA - 03 Mar, 2022 - Comments: 0

Designers and manufacturers worldwide are concerned about manufacturing cyber security and design data when using additive manufacturing technology. This whitepaper from Identify3D discusses how digital product data is shared during the additive manufacturing workflow and how that data might be better secured. Using products from Identify3D and Siemens, the entire additive manufacturing data ch... » read more

Preparing For Test Early In The Design Flow
By Ann Mutschler - 02 Mar, 2022 - Comments: 0

Until very recently, semiconductor design, verification, and test were separate domains. Those domains have since begun to merge, driven by rising demand for reliability, shorter market windows, and increasingly complex chip architectures. In the past, products were designed from a functional perspective, and designers were not concerned about what the physical implementation of the product ... » read more

Data Center Architectures In Flux
By Ann Mutschler - 24 Feb, 2022 - Comments: 0

Data center architectures are becoming increasingly customized and heterogeneous, shifting from processors made by a single vendor to a mix of processors and accelerators made by multiple vendors — including system companies' own design teams. Hyperscaler data centers have been migrating toward increasingly heterogeneous architectures for the past half decade or so, spurred by the rising c... » read more

Unintended Coupling Issues Grow
By Brian Bailey - 24 Feb, 2022 - Comments: 0

The number of indirect and often unexpected ways in which one design element may be affected by another is growing, making it more difficult to ensure a chip — or multiple chips in a package — will perform reliably. Long gone are the days when the only way that one part of a circuit could influence another was by an intended wire connecting them. As geometries get smaller, frequencies go... » read more

Dissolving The Barriers In Multi-Substrate 3D-IC Assembly Design
By Tarek Ramadan - 24 Feb, 2022 - Comments: 0

Advanced packaging continues to promise improved form factor, cost, performance, and functionality compared to the traditional transistor scaling on SoCs. This is done by integrating multiple dies on top of a substrate (organic or silicon). Besides multiple dies, multiple substrates can typically exist in a 3D-IC assembly. In this case, the benefits of advanced packaging are taken to a whole ne... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2024 SMG   |  Terms of Service  |  Privacy Policy