tag: Siemens EDA

The Complex Art Of Handling S-Parameters
By Pradeep Thiagarajan - 12 Sep, 2022 - Comments: 1

By Pradeep Thiagarajan and Youssef Abdelkader IC design is transforming at an accelerated pace along with fabrication technology. The need to incorporate more functionality has led to denser dies, multi-die chips, stacked 3D ICs, and advanced packaging. Furthermore, the increasing demand for enhanced connectivity with more and faster access to data continues to drive technology towards highe... » read more

Making 5G More Reliable
By Ed Sperling - 08 Sep, 2022 - Comments: 0

The rollout of 5G is a complex and monumental effort involving multiple separate systems that need to function flawlessly together in real-time, making it difficult to determine where problems might arise, or how and when to test for them. Investments in 5G have been underway for the better part of a decade, and the technology is considered the next huge growth opportunity for mobile devices... » read more

Enabling Test Strategies For 2.5D, 3D Stacked ICs
By Laura Peters - 08 Sep, 2022 - Comments: 0

Improved testability, coupled with more tests at more insertion points, are emerging as key strategies for creating reliable, heterogeneous 2.5D and 3D designs with sufficient yield.  Many changes need to fall into place to make side-by-side 2.5D and 3D stacking approaches cost-effective, particularly for companies looking to integrate chiplets from different vendors. Today, nearly all of t... » read more

The Drive Toward More Predictive Maintenance
By Anne Meixner - 08 Sep, 2022 - Comments: 0

Maintenance is a critical behind-the-scenes activity that keeps manufacturing facilities running and data centers humming. But when not performed in a timely manner, it can result in damaged products or equipment, or significant system/equipment downtime. By shifting from scheduled maintenance to predictive maintenance, factories and electronic system owners can reap substantial benefits, in... » read more

Affordable And Comprehensive Testing Of 3D Stacked Die Devices
By Siemens EDA - 07 Sep, 2022 - Comments: 0

Developers of high-end semiconductor products who face manufacturing limitations with respect to die sizes are investing in 3D stacked die technology. These advanced designs already push current design-for-test (DFT) solutions to the limits: tool run time, on-chip area demand, test pattern count, and test time. How then, can designers manage DFT for these new 3D devices? In this paper, we outli... » read more

Challenges Mount In New Autos
By John Koon - 06 Sep, 2022 - Comments: 0

Electronics are becoming the primary differentiator for carmakers, adding an array of options that can alter everything from how a vehicle's occupants interact with their surroundings to how the vehicle drives. But the infrastructure needed to support these features also raises a slew of technology and business questions for which there are no simple answers today. For example, how will new ... » read more

Reducing Schedule Slips With Automated Post-Route Verification Of SerDes High Speed Serial Links
By Todd Westerhoff - 01 Sep, 2022 - Comments: 1

Most high-speed serial links don’t get verified once routing is complete because the process is time consuming and skill-intensive – and SI experts are in short supply. As a result, most serial channels are laid out according to rules, verified through manual inspection, and released to fabrication without thorough analysis. Unverified channels can result in lengthy (and hectic) prototype d... » read more

Driver Monitoring Raises Complexity, Adds Privacy Concerns
By Marie C. Baca - 01 Sep, 2022 - Comments: 0

While you watch the road, your car may be watching you back. The automotive industry’s transition toward self-driving technology means cars increasingly are equipped with features that measure driver alertness and engagement, among many other data points. Executives say such features save lives and spur innovation, while simultaneously raising significant technical, legal, and ethical questio... » read more

Enabling Model-Based Design For DO-254 Certification Compliance
By Siemens EDA - 31 Aug, 2022 - Comments: 0

The increasing prevalence and cost of projects that need to comply with the DO-254 standard is forcing companies to evaluate their development processes. This white paper shows a development approach to compliance using model-based design. It covers how a DO-254 workflow using model-based design promotes a consistent requirements-oriented project view and increases reuse of design and verificat... » read more

Ensure Functional Safety Using Siemens’ AUTOSAR Solutions
By Siemens EDA - 29 Aug, 2022 - Comments: 0

As the prevalence of automated driving, electrification, and connected vehicle applications increases, the complexity of electrical and electronic (E/E) vehicle architecture is increasing, and vehicle safety requirements are becoming more demanding. Solution architects and engineers are looking for ways to manage it all. And they can, with the help of our comprehensive AUTOSAR solution that pro... » read more

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