tag: Siemens

The Good And Bad Of Chip Design On Cloud
By Ann Mutschler - 27 Jul, 2023 - Comments: 0

Semiconductor Engineering sat down to talk about how the shift toward chip design on cloud has sped up, whether the benefits of cloud are realized in chip design, and some of the most pressing challenges to chip design on cloud today, with Philip Steinke, fellow, CAD infrastructure and physical design at AMD; Mahesh Turaga, vice president of business development for cloud at Cadence Design Syst... » read more

Week In Review: Auto, Security, Pervasive Computing
By Liz Allan - 21 Jul, 2023 - Comments: 0

The Biden-Harris Administration announced the U.S. Cyber Trust Mark, a cybersecurity certification and labeling program to help consumers choose smart devices less vulnerable to cyberattacks. The Federal Communications Commission (FCC) is applying to register the Cyber Trust Mark with the U.S. Patent and Trademark Office and it would appear on qualifying smart products, including refrigerators,... » read more

Week In Review: Design, Low Power
By Jesse Allen - 21 Jul, 2023 - Comments: 0

Cadence will acquire Rambus' SerDes and memory interface PHY IP business. Rambus will retain its digital IP business, including memory and interface controllers and security IP. “With this transaction, we will increase our focus on market-leading digital IP and chips and expand our roadmap of novel memory solutions to support the continued evolution of the data center and AI,” said Sean Fan... » read more

Improving Performance And Lowering Power In Automotive
By Ann Mutschler - 20 Jul, 2023 - Comments: 0

Automotive OEMs are boosting their investments across the semiconductor ecosystem as stepping stones toward electrification and autonomy, and they are starting to encounter some of the same issues chipmakers have been wrestling with at advanced nodes — massive compute performance, thermal and power issues, reliability over extended lifetimes, and a highly diverse and geographically distribute... » read more

Week In Review: Design, Low Power
By SE Staff - 14 Jul, 2023 - Comments: 0

DAC and SEMICON WEST rebounded this year, focusing on everything from security to chiplets and smart manufacturing. Panel at DAC conference: Left to right, ARM’s Brian Fuller (moderator), Joe Costello (Metrics, Kwikbit, Arrikto, Acromove), and Wally Rhines (Cornami). Source: Semiconductor Engineering/Ann Mutschler EDA and IP remain strong, approaching $4 billion in Q1, according to ... » read more

Week In Review: Auto, Security, Pervasive Computing
By Liz Allan - 14 Jul, 2023 - Comments: 0

Google was hit with a class action suit in U.S. District Court in San Francisco, alleging data scraping from millions of users without consent and violation of copyright laws to train and develop its AI products. Last month, the same law firm filed a suit against OpenAI for ChatGPT. Despite calling for a pause on development of advanced AI in March, Elon Musk launched xAI, a new company focu... » read more

Curbing Automotive Cybersecurity Attacks
By John Koon - 06 Jul, 2023 - Comments: 1

The relentless cyberattacks on the automotive sector are not limited to vehicles and have an impact on the entire automotive supply chain, so the pressure is on the automotive ecosystem to understand the necessary standards and regulations for vehicles and components. While the process of attaining compliance adds additional effort, in the long run, the increase in cybersecurity will save the a... » read more

Week In Review: Semiconductor Manufacturing, Test
By SE Staff - 30 Jun, 2023 - Comments: 0

Restrictions on China continue to grow. The Biden Administration is considering more restrictions on selling advanced AI chips to China, according to multiple media reports. Meanwhile, the Dutch government is expected to limit the sale of manufacturing equipment. JIC Capital, the wholly owned subsidiary of Japan Investment Corporation (JIC), will purchase materials company JSR Corp. through ... » read more

Week In Review: Design, Low Power
By Jesse Allen - 30 Jun, 2023 - Comments: 0

Keysight Technologies said it intends to acquire ESI Group for €913 million (~$998.6 million). ESI Group provides virtual prototyping solutions for the automotive and aerospace end markets that can create real-time digital twins to simulate a product's behavior during testing and real-life use. MLCommons announced the latest results from two MLPerf benchmark suites. One aims to measure the... » read more

Blog Review: June 21
By Jesse Allen - 21 Jun, 2023 - Comments: 0

Synopsys' Vikram Bhatia identifies four trends driving the migration of EDA tools and chip design workloads to the cloud, from ever-increasing compute and time-to-market demands to advanced cybersecurity features. Cadence's Veena Parthan checks out how computational fluid dynamics and finite element analysis can help improve aquaculture with sustainable fish cage nets that minimize stagnatio... » read more

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