Week In Review: Auto, Security, Pervasive Computing


Security Flex Logix Technologies is partnering with Intrinsic ID to secure and protect any device using its eFPGA, so the device can’t be modified maliciously, through physical attacks or remote hacking. Flex Logix’s EFLX ePFGA will have Intrinsic ID’s SRAM physical unclonable function (PUF), a military-grade security IP that gives a device a unique silicon ID. The ID secures confidentia... » read more

Blog Review: July 20


Synopsys' Ron Lowman examines the various neural networks used in camera applications, the balancing act between camera lens choice and neural networks implemented, and how IP and embedded vision processors help optimize the designs. Siemens' Katie Tormala considers the importance of acoustic performance in consumer electronics and why it's important to understand the relationships between t... » read more

Week in Review: Manufacturing, Test


Fab capacity STMicroelectronics and GlobalFoundries inked a deal to build a new jointly-operated 300mm fab adjacent to ST’s existing 300mm facility in Crolles, France. This facility is targeted to ramp at full capacity by 2026, with up to 620,000 300mm wafer per year production at full build-out (~42% ST and ~58% GF). The new facility will support several technologies, with a special focus... » read more

Week In Review: Auto, Security, Pervasive Computing


Automotive, mobility The head of Tesla’s Autopilot division — Andrej Karpathy — resigned from the company after Tesla laid off 200 people in its Autopilot division and the U.S. National Highway Transportation Safety Administration broadened its safety investigation of Tesla’s Autopilot. The NHTSA last month broadened its August 2021 investigation, which was looking at why Tesla cars on... » read more

Blog Review: July 13


Siemens' John Sturtevant finds that the patterning requirements of next generation lithographic processes have pushed lithographers to explore the advantages of curvilinear masks, and notes some of the tools coming along to help. Cadence's Paul McLellan learns from Kyle Chen of Microsoft and Suomin Cui of Cadence how deep learning and electromagnetic solvers can be used to optimize high-dens... » read more

Chip Data Joins The Party


Perhaps you’ve heard of silicon lifecycle management (product lifecycle management for your semiconductor) but considered it a “far-future” practice that you can safely ignore for now. While many pieces of a complete silicon lifecycle solutions (SLS) are not yet in place, the components are coming together every day. Today, in fact, Siemens’ Tessent offers a new suite of software ser... » read more

What Formula 1 Racing Says About Auto’s High-Tech Future


To learn about the future of the auto industry, you can interview analysts and experts, peruse scientific publications, and attend various conferences. Or you can watch multi-million dollar race cars hurtle around a track at speeds of upwards of 220 miles per hour. Welcome to Formula 1, the international auto racing sport with a cumulative TV audience of 1.55 billion people. The budgets are ... » read more

Week In Review: Auto, Security, Pervasive Computing


Automotive, mobility The Lancet’s Road Safety 2022 report estimates that 1.35 million people die every year from road traffic injuries, with more than 50 million injured or disabled. Low-income and middle-income countries (LMICs) have the most deaths, accounting for 93% of the world's fatalities on roads. The four main risk factors for road injuries are speeding, impaired driving (drunk driv... » read more

Blog Review: June 29


Synopsys' Emilie Viasnoff argues that optical sensors are critical building blocks of autonomous vehicles and that sensor digital twins have the potential to dramatically reduce the amount of field testing needed by using driving simulators for tasks ranging from design and testing to integration and autonomous driving system co-optimization. Siemens' Sumit Vishwakarma considers the evolutio... » read more

EDA Embraces Big Data Amid Talent Crunch


The semiconductor industry’s labor crunch finally has convinced chip designers to bet big money on big data. As recently as 2016, executives weren’t sure there was a market for big data approaches to electronic design automation. The following year, utilization of big data remained stuck in its infancy. And in 2018, Semiconductor Engineering questioned why the EDA sector wasn’t investi... » read more

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