tag: signoff

Signal Integrity Methodology For Double-Digit Multi-Gigabit Interfaces
By Cadence - 07 Feb, 2018 - Comments: 0

As data rates for serial link interfaces such as PCI Express (PCIe) Gen 4 move into the double digits, device modeling, interconnect modeling, and analysis methodologies must continue to evolve to address the shrinking design margins and increasingly challenging compliance criteria facing today’s engineers. To mitigate risk and optimize designs, it is critical to move analysis as far upstream... » read more

Improving Automotive Reliability
By Annapoorna Krishnaswamy - 16 Oct, 2017 - Comments: 0

Semiconductor reliability requirements are rapidly evolving. New applications such as ADAS/self-driving cars and drones are pushing the limits for system reliability. A mobile phone that overheats in your pocket is annoying. In automobiles, it's a much different story. Overheating can impact the operation of backup sensors, which alert the driver that a pedestrian or obstacle is behind them.... » read more

Tech Talk: 7nm Power
By Ed Sperling - 19 Jun, 2017 - Comments: 0

Annapoorna Krishnaswamy, lead applications engineer at ANSYS, talks with Semiconductor Engineering about power-related changes at 7nm and what engineering teams need to watch out for as they move down to the latest process technology. https://youtu.be/Ym46ssJPeHM » read more

Choosing The Right Verification Technology For CDC-Clean RTL Signoff
By Cadence - 24 May, 2017 - Comments: 0

Modern system-on-chip (SoC) designs typically contain multiple asynchronous clock domains. Clock domain crossing (CDC) signals, those which traverse these domains, are often subject to metastability effects that can cause functional errors. Traditional methods like RTL simulation or static timing analysis alone are not sufficient to verify correct data transfer across clock domains. As a result... » read more

Optimization Challenges For 10nm And 7nm
By Brian Bailey - 11 Aug, 2016 - Comments: 0

Optimization used to be a simple timing against area tradeoff, but not anymore. As we go to each new node the tradeoffs become more complicated, involving additional aspects of the design that used to be dealt with in isolation. Semiconductor Engineering sat down to discuss these issues with Krishna Balachandran, director of product management for low-power products at [getentity id="22032"... » read more

Addressing Process Variation And Reducing Timing Pessimism At 16nm And Below
By Cadence - 13 Jul, 2016 - Comments: 0

At 16nm and below, on-chip variation (OCV) becomes a critically important issue. Increasing process variation makes a larger impact on timing, which becomes more pronounced in low-power designs with ultra-low voltage operating conditions. In this paper, we will discuss how a new methodology involving more accurate library characterization and variation modeling can reduce timing margins in libr... » read more

Power Estimation: Early Warning System Or False Alarm?
By Brian Bailey - 10 Sep, 2015 - Comments: 0

Semiconductor Engineering sat down with a large panel of experts to discuss the state of power estimation and to find out if the current levels of accuracy are sufficient to being able to make informed decisions. Panelists included: Leah Schuth, director of technical marketing in the physical design group at [getentity id="22186" comment="ARM"]; Vic Kulkarni, senior vice president and general m... » read more

System-Aware SoC Power, Noise And Reliability Sign-off
By Ansys - 08 Oct, 2014 - Comments: 0

In globally competitive markets for mobile, consumer and automotive electronic systems, the critical success factors are power consumption, performance and reliability. To manage these conflicting requirements, design teams consider multiple options, including the use of advanced process technology nodes — especially FinFET-based devices. These advanced technology nodes allow chips to operate... » read more

Signoff Intensity On The Rise
By The SE Staff - 15 Aug, 2014 - Comments: 2

By Ann Steffora Mutschler and Ed Sperling Lithography and signoff are crossing swords at 16/14nm and 10nm, creating new problems that raise questions about just how confident design teams will be when they sign off before tapeout — and how many respins are likely to follow. While designs at 20nm, 16nm and 14nm typically rely on colorless double patterning, at 10nm colors are mandatory. ... » read more

Design And Verification Survey Results
By Graham Bell - 27 Feb, 2014 - Comments: 1

Previously I have blogged about the verification surveys that Real Intent runs at tradeshows throughout the year.  We find it useful to track trends in tool needs and reveal what are the pain points designers are feeling.  I last reported to you, a year ago, in the blog article Clocks and Bugs, where I focused on clock-domain crossing (CDC) errors causing re-spins. This year, I would like ... » read more

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