中文 English

Overview of Silicon, Silicon Carbide and Gallium Nitride for Power Electronics


New open access research paper "Review and Evaluation of Power Devices and Semiconductor Materials Based on Si, SiC, and Ga-N" from various institutions in India mostly. Abstract "There is no reservation that semiconductor equipment distorted the world despite the fact of doing the practical experiments and also in research field. Researchers will communicate the process of semiconducto... » read more

Revolution In Embedded Security


The growth of computing, graphics, neural processing power, communication bandwidth, and storage capacities have enabled amazing solutions. These innovations have created great value for society, and that value must be protected from exploitation by adversaries. This whitepaper explores many of these major technology changes and how Rambus’ security offerings help in tackling the new embedded... » read more

Technology Advancements For Dynamic Function eXchange In Vivado ML Edition


As systems become more complex and designers are asked to do more with less, adaptability is a critical asset. While Xilinx FPGAs and SoCs always provided the flexibility to perform on-site device reprogramming, current constraints including increased cost, tighter board space, and power consumption demand even more efficient design strategies. Xilinx Dynamic Function eXchange (DFX) extends the... » read more

X-ray Imaging of Silicon Die Within Fully Packaged Semiconductor Devices


Abstract: "X-ray diffraction imaging (XRDI) (topography) measurements of silicon die warpage within fully packaged commercial quad-flat no-lead devices are described. Using synchrotron radiation, it has been shown that the tilt of the lattice planes in the Analog Devices AD9253 die initially falls, but after 100 °C, it rises again. The twist across the die wafer falls linearly with an incre... » read more

Defect Mitigation And Characterization In Silicon Hardmask Materials


From SPIE Digital Library: In this study, metal contaminants, liquid particle count and on-wafer defects of Si- HMs and filtration removal rates are monitored to determine the effect of filter type, pore size, media morphology, and cleanliness on filtration performance. 5-nm PTFE NTD2 filter having proprietary surface treatment used in this study shows lowest defect count. Authors: Vineet... » read more

Development Of Planarizing Spin-On Carbon Materials For High-Temperature Processes


Multilayer lithography is used for advanced semiconductor processes to pattern complex structures. As more and more procedures incorporate a high-temperature process, such as chemical vapor deposition (CVD), the need for thermally stable materials increases. For certain applications, a spin-on carbon (SOC) layer under the CVD layer is required to survive through a high-temperature process. ... » read more

The Long Road To Quantum Computing


Building a quantum computer is like building a cathedral. They both take a couple generations. The time frame for useful quantum computing applications that are not toy-sized is still a few years to a decade or more away. But the push is on now. Governments are racing to get their country’s quantum computing going for national security reasons. Companies such as Google and IBM are competin... » read more

System Bits: April 30


Future batteries could use a graphene sponge Researchers at Sweden’s Chalmers University of Technology devised a porous, sponge-like aerogel, made of reduced-graphene oxide, to serve as a freestanding electrode in the battery cell. This utilization has the potential to advance lithium sulfur batteries, which are said to possess a theoretical energy density about five times greater than lithi... » read more

From Sand To Wafers


More than most industries, ours is identified with a single element, silicon. Consider the self-adopted naming conventions of all the places that want to be recognized as members of the club—Silicon Valley, Silicon Beach, Silicon Forest and so on. Silicon wafers are fundamental in manufacturing the electronic “chips” that pervade almost every aspect of our lives. New applications in IoT, ... » read more

The Good And Bad Of 2D Materials


Despite years of warnings about reaching the limits of silicon, particularly at leading-edge process nodes where electron mobility is limited, there still is no obvious replacement. Silicon’s decades-long dominance of the integrated circuit industry is only partly due to the material’s electronic properties. Germanium, gallium arsenide, and many other semiconductors offer superior mobili... » read more

← Older posts