Development Of Planarizing Spin-On Carbon Materials For High-Temperature Processes


Multilayer lithography is used for advanced semiconductor processes to pattern complex structures. As more and more procedures incorporate a high-temperature process, such as chemical vapor deposition (CVD), the need for thermally stable materials increases. For certain applications, a spin-on carbon (SOC) layer under the CVD layer is required to survive through a high-temperature process. ... » read more

The Long Road To Quantum Computing


Building a quantum computer is like building a cathedral. They both take a couple generations. The time frame for useful quantum computing applications that are not toy-sized is still a few years to a decade or more away. But the push is on now. Governments are racing to get their country’s quantum computing going for national security reasons. Companies such as Google and IBM are competin... » read more

System Bits: April 30


Future batteries could use a graphene sponge Researchers at Sweden’s Chalmers University of Technology devised a porous, sponge-like aerogel, made of reduced-graphene oxide, to serve as a freestanding electrode in the battery cell. This utilization has the potential to advance lithium sulfur batteries, which are said to possess a theoretical energy density about five times greater than lithi... » read more

From Sand To Wafers


More than most industries, ours is identified with a single element, silicon. Consider the self-adopted naming conventions of all the places that want to be recognized as members of the club—Silicon Valley, Silicon Beach, Silicon Forest and so on. Silicon wafers are fundamental in manufacturing the electronic “chips” that pervade almost every aspect of our lives. New applications in IoT, ... » read more

The Good And Bad Of 2D Materials


Despite years of warnings about reaching the limits of silicon, particularly at leading-edge process nodes where electron mobility is limited, there still is no obvious replacement. Silicon’s decades-long dominance of the integrated circuit industry is only partly due to the material’s electronic properties. Germanium, gallium arsenide, and many other semiconductors offer superior mobili... » read more

Silicon’s Long Game


The era of all-silicon substrates and copper wires may be coming to an end. Progress in the future increasingly depends on more exotic combinations of materials that are developed for specific applications. But after years of predicting the death of silicon, it appears those predictions may be premature. That's not always obvious, given the growing number of chemical combinations being creat... » read more

More EUV Mask Gaps


Extreme ultraviolet (EUV) lithography is at a critical juncture. After several delays and glitches, [gettech id="31045" comment="EUV"] is now targeted for 7nm and/or 5nm. But there are still a number of technologies that must come together before EUV is inserted into mass production. And if the pieces don’t fall into place, EUV could slip again. First, the EUV source must generate more ... » read more

Still Waiting For III-V Chips


For years, chipmakers have been searching for an alternative material to replace traditional silicon in the channel for advanced CMOS devices at 7nm and beyond. There’s a good reason, too: At 7nm, silicon will likely run out of steam in the channel. Until recently, chipmakers were counting on III-V materials for the channels, at least for NFET. Compared to silicon, III-V materials provide ... » read more

Manufacturing Bits: Nov. 18


Street light EV charging stations Looking for a place to re-charge an electric car on the road? BMW has developed one possible solution, at least in Europe. The automotive giant has demonstrated a street lighting system that doubles as a charging station for electric vehicles. Part of a pilot project called Light and Charge, the first two prototype systems have moved into operation at BMW W... » read more

New Challenges For Post-Silicon Channel Materials


In order to bring alternative channel materials into the CMOS mainstream, manufacturers need not just individual transistor devices, but fully manufacturable process flows. Work presented at the recent IEEE Electron Device Meeting (Washington, D.C., Dec. 9-11, 2013) showed that substantial work remains to be done on almost all aspects of such a flow. First and most fundamentally, it is diffi... » read more

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