Curbing Automotive Cybersecurity Attacks

By John Koon - 06 Jul, 2023 - Comments: 1

The relentless cyberattacks on the automotive sector are not limited to vehicles and have an impact on the entire automotive supply chain, so the pressure is on the automotive ecosystem to understand the necessary standards and regulations for vehicles and components. While the process of attaining compliance adds additional effort, in the long run, the increase in cybersecurity will save the a... » read more

Optimizing Scan Test For Complex ICs

By Gregory Haley - 09 May, 2023 - Comments: 0

As chips become more heterogeneous with more integrated functionality, testing them presents increasing challenges — particularly for high-speed system-on-chip (SoC) designs with limited test pin availability. In addition, the complexity of emerging packages like 3D and chiplets necessitates comprehensive new solutions that can provide faster results at multiple stages in the silicon lifec... » read more

How Safe Is Safe Enough?

By Frank Schirrmeister - 04 May, 2023 - Comments: 1

That was the overarching question a group of 180 experts discussed last week at the ISO 26262 & SOTIF conference for four days during #FuSaWeek2023 in Berlin. "How Safe is Safe Enough" is also the title of Prof. Koopman's book from September 2022. I mentioned him in my blog "Are We Too Hard On Artificial Intelligence For Autonomous Driving?" Prof. Koopman was referenced often in Berlin, and... » read more

What’s Next In Wireless Standard Adoption?

By Chen Chang - 27 Apr, 2023 - Comments: 0

By Chen Chang and Alejandro Escobar Calderon Although each generation in wireless technologies often introduces enhanced capabilities, the broad adoption of any new technology requires both technical and business viability. For 5G, solving for technical challenges such as path loss and radio front-end efficiency has led to massive innovations in network design, semiconductor packaging, and t... » read more

Chiplets: More Standards Needed

By Andy Heinig - 13 Apr, 2023 - Comments: 1

Recent months have seen new advances in chiplet standardization. For example, consortia such as Bunch of Wires (BoW) and Universal Chiplet Interconnect Express (UCIe) have made progress in developing standards for die-to-die (D2D) interfaces in a chiplet’s design. Far from being a new phenomenon in communication, these types of standards are established for all forms of wired and wireless com... » read more

Chiplet Security Risks Underestimated

By Ann Mutschler - 06 Apr, 2023 - Comments: 0

The semiconductor ecosystem is abuzz with the promise of chiplets, but there is far less attention being paid to security in those chiplets or the heterogeneous systems into which they will be integrated. Disaggregating SoCs into chiplets significantly alters the cybersecurity threat landscape. Unlike a monolithic multi-function chip, which usually is manufactured using the same process tech... » read more

Growing Challenges For Increasingly Connected Vehicles

By John Koon - 06 Apr, 2023 - Comments: 0

Automobiles will become increasingly connected over the next decade, but that connectivity will come at a price in terms of dollars, security, and constantly changing technology. Connectivity involves all parts of a vehicle. It includes everything from autonomous driving to in-cabin monitoring and connected infotainment. And it encompasses external sensors, IoT, V2X, over-the-air communicati... » read more

CXL Picks Up Steam In Data Centers

By Marie C. Baca - 26 Jan, 2023 - Comments: 0

CXL is gaining traction inside large data centers as a way of boosting utilization of different compute elements, such as memories and accelerators, while minimizing the need for additional racks of servers. But the standard is being extended and modified so quickly that it is difficult to keep up with all the changes, each of which needs to be verified and validated across a growing swath of h... » read more

Efficient Trace In RISC-V

By Ed Sperling - 19 Dec, 2022 - Comments: 0

Systems with RISC-V cores often include multiple types of other processors and accelerators. Peter Shields, product manager for Tessent at Siemens Digital Industries Software, talks about what's needed for debug and trace in context, including the need for unobtrusive observation at full speed, what to trace and when to trace it, and how embedded IP can identify to report which branches are tak... » read more

The Politics Of Standards

By Brian Bailey - 22 Nov, 2022 - Comments: 1

Standards often are seen as an industry coming together to agree upon a common solution to a common problem, but there are times when this could not be further from the truth. Having been involved in standards at all levels — from participant to chair for several standards — some were successful, some were not, some are seeing significant adoption while others are withering by the wayside, ... » read more

← Older posts Newer posts →

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?