tag: STMicroelectronics

The Week In Review: Manufacturing
By Mark LaPedus - 12 Jan, 2018 - Comments: 0

Chipmakers Intel and Micron have ended their long-running NAND joint development partnership. The companies will continue to develop NAND, but they will work independently on future generations of 3D NAND. The companies have agreed to complete the development of their third-generation of 3D NAND technology, which will be delivered towards the end of 2018. That is expected to be a 96-layer ... » read more

The Week In Review: Design
By Jesse Allen - 15 Dec, 2017 - Comments: 0

M&A Synopsys finalized its acquisition of Black Duck Software, which provides software for managing and securing open source software in projects, adding to Synopsys' burgeoning software analysis and security business. The cash deal was approximately $547 million net of cash acquired. STMicroelectronics acquired Atollic, maker of the Eclipse-based TrueSTUDIO Integrated Development Envir... » read more

Shortages Hit Packaging Biz
By Mark LaPedus - 11 Dec, 2017 - Comments: 1

Rising demand for chips is hitting the IC packaging supply chain, causing shortages of select manufacturing capacity, various package types, leadframes and even some equipment. Spot shortages for some IC packages began showing up earlier this year, but the problem has been growing and spreading since then. Supply imbalances reached a boiling point in the third and fourth quarters of this yea... » read more

The New Road Warriors
By Jeff Dorsch - 27 Nov, 2017 - Comments: 0

Chip vendors and other companies that have little or no experience in automotive are flooding into this market as the race for assisted and autonomous driving begins to heat up. This market is expected to pay big dividends for companies that succeed in helping to build the vehicles of the future in this century. IC Insights earlier this year forecast the auto chip market would grow 22% this ... » read more

The Return Of Body Biasing
By Ann Mutschler - 15 Nov, 2017 - Comments: 1

Body biasing is making a comeback across a wide swath of process nodes as designers wrestle with how to build mobile devices with more functionality and longer battery life. Consider an ultra-low-power IoT device with a wireless sensor, for example, which is meant to last for years without changing a battery. Body biasing can be used to create an ultra-low-leakage sleep state. “In that ... » read more

Rapid Pattern Sequencing And Optimization With STAR Hierarchical System At STMicroelectronics
By Synopsys - 08 Nov, 2017 - Comments: 0

This white paper is the second in a series of two papers on STMicroelectronics’ experience with the Synopsys DesignWare STAR Hierarchical System. This white paper also provides insights on IEEE 1500 based network implementation, execution and analysis. It details the MASIS file’s pattern sequencing which is used for production tests and helps minimize test time. For the thermal sensor examp... » read more

STMicroelectronics’ Implementation Of The STAR Hierarchical System And IEEE 1500 Wrapping
By Synopsys - 01 Nov, 2017 - Comments: 0

This white paper discusses various IEEE 1500 architectures that STMicroelectronics has deployed using the Synopsys DesignWare STAR Hierarchical System test solution. STAR Hierarchical System allows users to optimize test time on system-on-chips that use multiple cores. The white paper provides guidelines on interface IP wrapping with IEEE 1500 to improve test time. In addition, it discusses the... » read more

Evolution Of The MCU
By Ed Sperling - 26 Oct, 2017 - Comments: 0

Microcontrollers are taking on a variety of new and much more complex computing tasks, evolving from standalone chips to more highly integrated devices that can rival complex microprocessors. Microcontroller units (MCUs) are being designed into everything from assisted and autonomous driving to smart cards. They often are the central processing elements for a slew of connected devices that i... » read more

MEMS Market Shifting
By Ed Sperling - 19 Oct, 2017 - Comments: 0

The MEMS sector is beginning to look more promising, bolstered by new end-market demand and different packaging options that require more advanced engineering, processes and new materials. All of this points to higher selling prices, which are long overdue in this space. For years, the market for microelectromechanical systems was populated by too many companies vying for too few opportunit... » read more

Integrated Passives Market Gets Active
By Jeff Dorsch - 09 Oct, 2017 - Comments: 0

Integrated passive devices are seeing greater use within system-in-package technology and numerous applications, including the Internet of Things. The tiny devices are making their way into automotive electronics, consumer electronics, and health-care products, among other uses. Europe is leading the way in supplying IPDs, thanks to offerings from Infineon Technologies, STMicroelectronics, a... » read more

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