Optimizing System-Level Connectivity In Heterogenous Automotive Packages


By Keith Felton and Cristina Somma With the massive growth of electronics in the automotive sector (such as autonomous driving, electric vehicles, and safety systems), the complexity, capabilities, and volume of semiconductors is rapidly increasing the demand for greater package connectivity density. This has led to high-end IC-package solutions, such as copper pillar bumping with very fi... » read more

Inspecting, Testing, And Measuring SiC


Achieving the auto industry's stringent zero defect goals is becoming a big challenge for makers of silicon carbide substrates, which are struggling to achieve sufficient yields and reliability as they migrate from 150mm to 200mm wafers and shift their focus away from pure silicon. SiC is a combination of silicon and harder carbide materials, and it has emerged as a key technology for batter... » read more

STMicroelectronics Methodology And Process For Heterogeneous Automotive Package Design


As a leading supplier of automotive semiconductors, STMicroelectronics must continue to move fast to develop and deliver leading-edge solutions. Employing package design as part of system innovation requires the STMicroelectronics Back-End Manufacturing Technology R&D organization to embrace the key driving forces of product development. In the automotive field, package designers need to... » read more

The Silicon Carbide Race Begins


The growing adoption of silicon carbide (SiC) for a variety of automotive chips has reached the tipping point where most chipmakers now consider it a relatively safe bet, setting off a scramble to stake a claim and push this wide-bandgap technology into the mainstream. SiC holds great promise for a number of automotive applications, particularly for battery electric vehicles. It can extend d... » read more

40 GHz VCO and Frequency Divider in 28 nm FD-SOI CMOS Technology for Automotive Radar Sensors


Abstract: "This paper presents a 40 GHz voltage-controlled oscillator (VCO) and frequency divider chain fabricated in STMicroelectronics 28 nm ultrathin body and box (UTBB) fully depleted silicon-on-insulator (FD-SOI) complementary metal-oxide–semiconductor (CMOS) process with eight metal layers back-end-of-line (BEOL) option. VCOs architecture is based on an LC-tank with p-type metal-oxide�... » read more

Week In Review: Manufacturing, Test


Chipmakers, OEMs At Intel’s Architecture Day this week, the company revealed several new chip architectures. Some were already announced, while others are new. These include Intel’s first performance hybrid architecture, a data center architecture, a discrete gaming graphics processing unit (GPU) architecture, infrastructure processing units (IPUs), and a data center GPU architecture. Here... » read more

Week In Review: Manufacturing, Test


Chipmakers Intel has outlined its new process technology roadmap with plans to regain the leadership position in the market. As part of the move, Intel has changed the way it designates the nodes, revealed its new gate-all-around (GAA) transistor, and disclosed a customer for the GAA technology--Qualcomm. And not to be outdone, Intel has broadened its packaging portfolio. Intel is changing ... » read more

Chip Shortages Grow For Mature Nodes


The current wave of chip shortages is expected to last for the foreseeable future, particularly for a growing list of critical devices produced in mature process nodes. Chips manufactured at mature nodes typically fall under the radar, but they are used in nearly every electronic device, including appliances, cars, computers, displays, industrial equipment, smartphones, and TVs. Many of thes... » read more

Week In Review: Auto, Security, Pervasive Computing


Pervasive computing — IoT, edge, cloud, data center, and back The IoT designer Deed designed a screenless health monitor, worn on the wrist, that uses IoT (Internet of Things) building blocks from Infineon Technologies. The Get bracelet interprets hand gestures for making payments, picking up phone calls, turning up or down audio, while it also takes health data and biometrics. The system us... » read more

Week In Review: Manufacturing, Test


Chipmakers and OEMs More delays and product woes at Intel. “INTC disclosed that it is delaying the launch of its next-generation Xeon server processor Sapphire Rapids (10nm) from the end of this year to 1Q22 due to additional validation needed for the chip,” said John Vinh, an analyst at KeyBanc, in a research note. “Production is expected to begin in 1Q22, with the ramp expected to begi... » read more

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