tag: strain

Die-To-Die Stress Becomes A Major Issue
By Ann Mutschler - 14 Jan, 2021 - Comments: 2

Stress is becoming more critical to identify and plan for at advanced nodes and in advanced packages, where a simple mismatch can impact performance, power, and the reliability of a device throughout its projected lifetime. In the past, the chip, package, and board in a system generally were designed separately and connected through interfaces from the die to the package, and from the packag... » read more

The Good And Bad Of 2D Materials
By Katherine Derbyshire - 27 Feb, 2019 - Comments: 0

Despite years of warnings about reaching the limits of silicon, particularly at leading-edge process nodes where electron mobility is limited, there still is no obvious replacement. Silicon’s decades-long dominance of the integrated circuit industry is only partly due to the material’s electronic properties. Germanium, gallium arsenide, and many other semiconductors offer superior mobili... » read more

Increasing Challenges At Advanced Nodes
By Ed Sperling - 22 Oct, 2015 - Comments: 1

Gary Patton, chief technology officer at GlobalFoundries, sat down with Semiconductor Engineering to talk about new materials, stacked die, how far FD-SOI can be extended, and new directions for interconnects and transistors. What follows are excerpts of that conversation. SE: Where do you see problems at future nodes? Patton: At the device level, we have to be able to pattern these thing... » read more

What’s After 10nm?
By Mark LaPedus - 14 Nov, 2013 - Comments: 0

For some time, chipmakers have roughly doubled the transistor count at each node, while simultaneously cutting the cost by around 29%. IC scaling, in turn, enables faster and lower cost chips, which ultimately translates into cheaper electronic products with more functions. Consumers have grown accustomed to the benefits of Moore’s Law, but the question is for how much longer? Chips based ... » read more

Mobility Gets A Boost With Expanded Epi Applications
By Applied Materials Writers - 17 Jul, 2013 - Comments: 0

By Jeremy Zelenko Even as industry moves into the era of the high k metal gate (HKMG) and FinFET transistor, chipmakers continue to seek ways to improve device performance. One of the latest advances and the subject of an Applied Materials announcement made today is to extend epitaxial deposition from PMOS to NMOS transistors. Implementing an NMOS epitaxy (epi) process in addition to the estab... » read more

GloFo Says 28nm FD-SOI Die Cost Much Less Than 28nm Bulk HPP
By Various Writers - 17 Jul, 2013 - Comments: 0

Posted by Adele Hars, Editor-in-Chief, Advanced Substrate News ~  ~ According to Shigeru Shimauchi, Country Manager, GlobalFoundries Japan, for the same level of performance, the die cost for 28nm FD-SOI will be substantially less than for 28nm bulk HPP (“high performance-plus”). Specifically, to get a 30%  increase in performance over 28nm bulk LPS PolySiON, HPP increases die ... » read more

VLSI Kyoto – The SOI Papers
By Various Writers - 19 Jun, 2013 - Comments: 0

By Adele Hars There were some breakthrough FD-SOI and other excellent SOI-based papers that came out of the 2013 Symposia on VLSI Technology and Circuits in Kyoto (June 10-14, 2013). By way of explanation, VSLI comprises two symposia: one on Technology; one on Circuits. However, papers that are relevant to both were presented in “Jumbo Joint Focus” sessions.  The papers should all b... » read more

SPOTLIGHT ON FD-SOI, FINFETS AT IEEE SOI CONFERENCE
;1-4 OCT, NAPA
By Various Writers - 25 Sep, 2012 - Comments: 0

The 38th annual SOI Conference is coming right up. Sponsored by IEEE Electron Devices Society, this is the only dedicated SOI conference covering the full technology chain from materials to devices, circuits and system applications. Chaired this year by Gosia Jurczak (manager of the Memories Program at imec), this excellent conference is well worth attending. It’s where the giants of the ... » read more

Leti Looks at Using Strain with FD-SOI for High-Perf Apps
By Various Writers - 29 Jun, 2012 - Comments: 0

The researchers at Leti working on FD-SOI have extremely deep expertise in it. One of the areas they've looked at is performance boosters. With the interest in FD-SOI rapidly increasing on the heels of the recent ST-GF announcement, their work becomes even more timely. A key Leti team wrote a summary of some recent strain work, which first appeared as part of the Advanced Substra... » read more

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