tag: Swiss Federal Laboratories for Materials Science and Technology

Chip Industry Technical Paper Roundup: Jan. 16
By Liz Allan - 16 Jan, 2024 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=188 /] More ReadingTechnical Paper Library home » read more

A Potentially CMOS Compatible Integration Of Reconfigurable FETs Based On Al-Si-Al Heterostructure Sheets
By Technical Paper Link - 11 Jan, 2024 - Comments: 0

A technical paper titled “Reconfigurable Si Field-Effect Transistors With Symmetric On-States Enabling Adaptive Complementary and Combinational Logic” was published by researchers at TU Vienna and Swiss Federal Laboratories for Materials Science and Technology. Abstract: "Reconfigurable field-effect transistors (RFETs), combining n-and p-type operation in a single device, have already sho... » read more

Technical Paper Roundup: Sept 5
By Liz Allan - 05 Sep, 2023 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=132 /] (more…) » read more

Contacting Individual On-Surface Synthesized Graphene Nanoribbons In A Multigate Transistor Geometry 
By Technical Paper Link - 28 Aug, 2023 - Comments: 0

A technical paper titled “Contacting individual graphene nanoribbons using carbon nanotube electrodes” was published by researchers at Swiss Federal Laboratories for Materials Science and Technology, Peking University, University of Warwick, National Center for Nanoscience and Technology (China), Max Planck Institute for Polymer Research, University of Bern, University of Basel, and ETH Zur... » read more

Chip Industry’s Technical Paper Roundup: July 18
By Liz Allan - 18 Jul, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=118 /] (more…) » read more

Antenna For Nanoscale Light Source By Placing The TMD Outside The Tunnelling Pathway
By Technical Paper Link - 13 Jul, 2023 - Comments: 0

A technical paper titled "Exciton-assisted electron tunnelling in van der Waals heterostructures" was published by researchers at ETH Zürich, The Barcelona Institute of Science and Technology, Swiss Federal Laboratories for Materials Science and Technology, National Institute for Materials Science, University of Basel, and Institució Catalana de Recerca i Estudis Avançats (ICREA). Abstract:... » read more

Chip Industry’s Technical Paper Roundup: Nov. 15
By Linda Christensen - 15 Nov, 2022 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=63 /] » read more

Using More Germanium In Chips for Energy Efficiency & Achievable Clock Frequencies
By Technical Paper Link - 08 Nov, 2022 - Comments: 0

A new technical paper titled "Composition Dependent Electrical Transport in Si1−xGex Nanosheets with Monolithic Single-Elementary Al Contacts" was published by researchers at TU Wien (Vienna University of Technology), Johannes Kepler University, CEA-LETI, and Swiss Federal Laboratories for Materials Science and Technology. Find the technical paper here. Published September 2022. Abstrac... » read more

System Bits: Feb. 19
By Jeff Dorsch - 19 Feb, 2019 - Comments: 0

Eco-friendly material for wireless IoT sensors Researchers at Canada’s Simon Fraser University and in Switzerland collaborated on developing a wood-derived cellulose material that could be used in a 3D printer, instead of the customary plastic and polymeric materials for electronics. With 3D printing, the material can offer flexibility to add or embed functions onto 3D shapes or fabrics, the... » read more

Power/Performance Bits: Nov 28
By Linda Christensen - 28 Nov, 2017 - Comments: 0

Deep learning to detect nuclear reactor cracks Inspecting nuclear power plant components for cracks is critical to preventing leaks, as well as to control in maintenance costs. But the current vision-based crack detection approaches are not very effective. Moreover, they are prone to human error, which in the case of nuclear power can be disastrous. To address this problem, Purdue Universit... » read more

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