How To Reduce The Impact Of The Global Microcontroller Shortage On ECU Software Development

By Siemens EDA - 03 Nov, 2021 - Comments: 0

The COVID-19 pandemic had a massive impact on all facets of business and commerce, as widespread supply chain disruptions rippled through every industry. Multiple factors collided to create a global microcontroller shortage that is now impacting the automotive industry, and is forcing developers to redesign Electronic Control Units (ECUs) using alternative Microcontrollers (MCUs) and to otherwi... » read more

Next-Gen SerDes Roadmap

By Ed Sperling - 25 May, 2021 - Comments: 0

An explosion in data is causing a series of successive bottlenecks in the data center. Priyank Shukla, product marketing manager for high-speed SerDes IP at Synopsys, digs into the performance roadmap for moving data within server racks and between different racks, where the bottlenecks are today, and how they will be addressed in the future. Related SerDes Knowledge Center Top stories... » read more

ML Opening New Doors For FPGAs

By Bryon Moyer - 24 Jun, 2020 - Comments: 0

FPGAs have long been used in the early stages of any new digital technology, given their utility for prototyping and rapid evolution. But with machine learning, FPGAs are showing benefits beyond those of more conventional solutions. This opens up a hot new market for FPGAs, which traditionally have been hard to sustain in high-volume production due to pricing, and hard to use for battery-dri... » read more

High-Speed SerDes At 7nm

By Ed Sperling - 30 Jul, 2018 - Comments: 0

eSilicon’s David Axelrad discusses the challenges with 56Gbps and 112Gps SerDes, and why the switch from analog to digital is required for performance and low power. https://youtu.be/E-CU8TLvjjc » read more

The Insatiable Need For Bandwidth

By Nick Ilyadis - 06 Jul, 2017 - Comments: 0

With the push for more and more Wi-Fi bandwidth, the WLAN industry, its standards committees, and the Ethernet switch manufacturers are having a hard time keeping up with the need for more speed. As the industry prepares for upgrading to 802.11ac Wave 2 and the promise of 11ax, the ability of Ethernet over existing copper wiring to meet the increased transfer speeds is being challenged. And wha... » read more

Power/Performance Bits: Nov. 1

By Jesse Allen - 01 Nov, 2016 - Comments: 0

New approach to switches According to the National Resource Defense Council, Americans waste up to $19 billion annually in electricity costs due to always-on digital devices in the home that suck power even when they are turned off. With that in mind, a team from University of Utah devised a new kind of switch for electronic circuits that uses solid electrolytes such as copper sulfide to ... » read more

Power/Performance Bits: Aug. 9

By Jesse Allen - 09 Aug, 2016 - Comments: 0

Phase-change memory Researchers at Stanford are working on phase-change memory technology, which could deliver the best of volatile and non-volatile memory. Phase-change materials can exist in two different atomic structures, each of which has a different electronic state. A crystalline, or ordered, atomic structure, permits the flow of electrons, while an amorphous, or disordered, struct... » read more

Avogy: Vertical GaN Power Devices

By Mark LaPedus - 02 Feb, 2015 - Comments: 0

Gallium nitride (GaN), a binary III-V bandgap material, has been used to make LEDs for the last several years. GaN has also been touted as the next big thing in power electronics and RF. To some degree, GaN has made inroads in RF, especially in high-end defense and aerospace applications. But the technology is having mixed success in power electronics. Today’s GaN-on-silicon devices are l... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

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