tag: Synopsys

Blog Review: April 20
By Jesse Allen - 20 Apr, 2022 - Comments: 0

Cadence's Paul McLellan looks at the difference between 3D packaging and 3D integration and the different approaches to system-in-package designs. Siemens' Spencer Acain finds that despite having less precision and flexibility than digital chips, analog computing is having a resurgence in the space of cutting-edge AI thanks to the speed and energy efficiency in specialized tasks. Synopsys... » read more

Week In Review: Auto, Security, Pervasive Computing
By SE Staff - 15 Apr, 2022 - Comments: 0

Automotive, mobility An engine-sensor malfunction in three popular Japanese-versions of the Subaru models has forced the company to suspend production temporarily in Japan, according to Reuters. The sensor in the CB18 engine, found in Japan’s Forester, Outback, and Levor cars, stops the engine from starting and flashes a warning light. In North America, Subaru is adding a wide-angle mono cam... » read more

Always-On, Ultra-Low-Power Design Gains Traction
By Ann Mutschler - 14 Apr, 2022 - Comments: 0

A surge of electronic devices powered by batteries, combined with ever-increasing demand for more features, intelligence, and performance, is putting a premium on chip designs that require much lower power. This is especially true for always-on circuits, which are being added into AR/VR, automotive applications with over-the-air updates, security cameras, drones, and robotics. Also known as ... » read more

If These Chips Could Talk: Actionable Insights From Path Margin Monitors
By Ash Patel - 14 Apr, 2022 - Comments: 0

One of the most important current trends in electronics is the gathering and analysis of big data to reap benefits in cost, power, performance, and reliability. This is becoming common in the chip development flow. For example, data harvested from simulation regressions can aid in debug and reaching coverage goals. Machine learning (ML) uses the results of many passes through implementation (lo... » read more

Architecting Faster Computers
By Brian Bailey - 14 Apr, 2022 - Comments: 3

To create faster computers, the industry must take a major step back and re-examine choices that were made half a century ago. One of the most likely approaches involves dropping demands for determinism, and this is being attempted in several different forms. Since the establishment of the von Neumann architecture for computers, small, incremental improvements have been made to architectures... » read more

Blog Review: April 13
By Jesse Allen - 13 Apr, 2022 - Comments: 0

Synopsys' Scott Durrant, Priyank Shukla, Mitch Heins, and Jigesh Patel provide a brief overview of the history of copper and optical interconnects used in data centers, the limitations of existing interconnect solutions, and the future of co-packaged optics. Siemens' Trey Reeser finds that it's not only necessary for semiconductor companies to address the safety and security of products for ... » read more

Key Applications For In-Chip Monitoring IP
By Synopsys - 13 Apr, 2022 - Comments: 0

The latest SoCs on advanced semiconductor nodes especially FinFET, typically include a fabric of sensors spread across the die and for good reason. But why and what are the benefits? This article explores some of the key applications for In Chip monitoring and why embedding In Chip monitoring IP is an essential step to maximize performance and reliability and minimize power, or a combination of... » read more

Choosing The Right Server Interface Architectures For High Performance Computing
By Jerry Lotto - 12 Apr, 2022 - Comments: 0

The largest bulk and cost of a modern high-performance computing (HPC) installation involves the acquisition or provisioning of many identical systems, interconnected by one or more networks, typically Ethernet and/or InfiniBand. Most HPC experts know that there are many choices between different server manufacturers and the options of form factor, CPU, RAM configuration, out of band management... » read more

Finding And Applying Domain Expertise In IC Analytics
By Anne Meixner - 12 Apr, 2022 - Comments: 0

Behind PowerPoint slides depicting the data inputs and outputs of a data analytics platform belies the complexity, effort, and expertise that improve fab yield. With the tsunami of data collected for semiconductor devices, fabs need engineers with domain expertise to effectively manage the data and to correctly learn from the data. Naively analyzing a data set can lead to an uninteresting an... » read more

Made in the Cloud!
By Synopsys - 12 Apr, 2022 - Comments: 0

While software developers have been building and delivering software in the cloud for many years now, how much IC hardware is “made in the cloud”? We’re here to help you understand the case for IC hardware development in the cloud and answer the most common questions. Download the paper and learn: Why isn’t everybody doing it? Why cloud? Why now? Can you afford to ignore i... » read more

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