Week In Review: Design, Low Power


Cadence added new machine learning functionality to its Xcelium Logic Simulator to speed verification closure on randomized regressions. Xcelium ML directly interfaces to the simulation kernel and learns iteratively over an entire simulation regression, guiding the Xcelium randomization kernel on subsequent regression runs to achieve matching coverage with reduced simulation cycles. Kioxia adop... » read more

Week In Review: Auto, Security, Pervasive Computing


Pervasive computing — data center, edge, IoT Maxim Integrated’s new USB-C Power Delivery products — the MAX77958 USB-C PD controller and the MAX77962 28W buck-boost charger — are aimed at devices, such as IoT or mobile phones, that need more power or for fast charging. To shave time off development and cost when changing from single-cell to two-series cell architectures, these are USB-... » read more

The Emergence Of Hardware As A Key Enabler For The Age Of Artificial Intelligence


Over the past few decades, software has been the engine of innovation for countless applications. From PCs to mobile phones, well-defined hardware platforms and instruction set architectures (ISA) have enabled many important advancements across vertical markets. The emergence of abundant-data computing is changing the software-hardware balance in a dramatic way. Diverse AI applications in fa... » read more

Preparing For A Barrage Of Physical Effects


Advancements in 3D transistors and packaging continue to enable better power and performance in a given footprint, but they also require more attention to physical effects stemming from both increased density and vertical stacking. Even in planar chips developed at 3nm, it will be more difficult to build both thin and thick oxide devices, which will have an impact on everything from power to... » read more

Power And Performance Optimization At 7/5/3nm


Semiconductor Engineering sat down to discuss power optimization with Oliver King, CTO at Moortec; João Geada, chief technologist at Ansys; Dino Toffolon, senior vice president of engineering at Synopsys; Bryan Bowyer, director of engineering at Mentor, a Siemens Business; Kiran Burli, senior director of marketing for Arm's Physical Design Group; Kam Kittrell, senior product management group d... » read more

Virtual Prototyping For Electric Vehicles: From System To Software


Road vehicles have long been considered one of the most challenging types of development projects. The tight interaction between electrical and mechanical components and the inherent safety requirements of high-speed/high-power operation are just the baseline issues. Layered on top of that are the many challenges of the physical environment: wide temperature and humidity range, noise, vibration... » read more

Chiplet Reliability Challenges Ahead


Assembling chips using LEGO-like hard IP is finally beginning to take root, more than two decades after it was first proposed, holding the promise of faster time to market with predictable results and higher yield. But as these systems of chips begin showing up in mission-critical and safety-critical applications, ensuring reliability is proving to be stubbornly difficult. The main driver fo... » read more

Blog Review: Aug. 12


Arm's Greg Yeric takes a look at what semiconductor manufacturing might look like in 2030 as the price of equipment rises and possibilities for when the next upgrade to EUV, high numerical aperture, eventually runs out of steam. Synopsys' Taylor Armerding explains the difference between bugs and security flaws and why it's so important to pay attention to potential problems in a design's spe... » read more

Week In Review: Manufacturing, Test


Chipmakers Nvidia is in advanced talks to acquire Arm from Softbank, according to numerous reports. In addition, TSMC and Foxconn are looking at possible investments or stakes in Arm, according to a report from Nikkei Asia Review. Infineon posted mixed results for the third quarter of the 2020 fiscal year. "Infineon has so far coped well with the challenging situation caused by the coronavi... » read more

Week In Review: Design, Low Power


M&A Goodix acquired Dream Chip Technologies. Shenzhen-based Goodix is known for fingerprint and other biometric sensors and authentication solutions, as well as Arm and RISC-V based MCUs. It is reportedly among the ten largest Chinese chipmakers, according to EqualOcean. Terms of the deal were not disclosed. Based in Garbsen, Germany, Dream Chip Technologies originally was founded in ... » read more

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