ML Automotive Chip Design Takes Off


Machine learning is increasingly being deployed across a wide swath of chips and electronics in automobiles, both for improving reliability of standard parts and for the creation of extremely complex AI chips used in increasingly autonomous applications. On the design side, the majority of EDA tools today rely on reinforcement learning, a machine learning subset of AI that teaches a machine ... » read more

Going Virtual In Automotive Electronics Development


Developing the electrical/electronic (E/E) systems in automobiles and other vehicles has always been challenging due to the rough environmental conditions experienced on the road and the high expectations for safety and reliability. In recent years, these challenges have been exacerbated by several industry trends. They have triggered a revolution in how electronic control units (ECUs) are desi... » read more

Data Leakage Becoming Bigger Issue For Chipmakers


Data leakage is becoming more difficult to stop or even trace as chips become increasingly complex and heterogeneous, and as more data is stored and utilized by chipmakers for other designs. Unlike a cyberattack, which typically is done for a specific purpose, such as collecting private data or holding a system ransom, data leaks can spring up anywhere. And as the value of data increases, th... » read more

Role Of IoT Software Expanding


IoT software is becoming much more sophisticated and complex as vendors seek to optimize it for specific applications, and far more essential for vendors looking to deliver devices on-time and on-budget across multiple market segments. That complexity varies widely across the IoT. For example, the sensor monitoring for a simple sprinkler system is far different than the preventive maintenanc... » read more

Blog Review: May 3


Synopsys' Thomas Andersen considers the requirements of AI-optimized chips that are resulting in exploration of different memory configurations, different types of memory, and different types of processor technologies and software components. Cadence's Girish Vaidyanathan considers the role of hierarchy and partitioning in custom design and looks at how a virtual hierarchy allows layout desi... » read more

Accelerating Coverage Closure With AI-Based Verification Space Optimization


Coverage is at the heart of all modern semiconductor verification. There is no maxim more fundamental to this process than “if you haven’t exercised it, you haven’t verified it.” Although covering a particular aspect of a chip design does not guarantee that all bugs are found — bug effect propagation and checker quality are also key factors — it is certainly true that bugs cannot po... » read more

AI Adoption Slow For Design Tools


A lot of excitement, and a fair amount of hype, surrounds what artificial intelligence (AI) can do for the EDA industry. But many challenges must be overcome before AI can start designing, verifying, and implementing chips for us. Should AI replace the algorithms in use today, or does it have a different role to play? At the end of the day, AI is a technique that has strengths and weaknesses... » read more

Week In Review: Semiconductor Manufacturing, Test


The U.S. Commerce Department  launched Chips.gov, a website that covers all aspects of the CHIPS Act, including funding opportunities and job openings. In similar vein, Intel CEO Pat Gelsinger focused on the future of semiconductor manufacturing in America in a talk at MIT. Intel has committed to expanding semiconductor manufacturing in the U.S., including spending an initial $20 billion on ne... » read more

Week In Review: Design, Low Power


The National Institute of Standards and Technology (NIST) outlined its plan for a National Semiconductor Technology Center (NSTC) to be created using a share of the $11 billion in funds from the CHIPS Act marked for research and development. While a large portion of the CHIPS Act investment is set to boost U.S. fabs and manufacturing capabilities, the NSTC aims to also support the design side, ... » read more

Week In Review: Auto, Security, Pervasive Computing


Pervasive computing Renesas introduced a narrowband Internet of Things (NB-IoT) chipset and dev kit for the Indian market. The LTE NB-IoT modem chipset, the RH1NS200, was designed for Indian telecommunications carriers by targeting bands 1,3, 5 and 8 and by following India’s carrier-approved LTE protocol stack and software suite. Low power usage is built in — it has a low Power Saving Mode... » read more

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