tag: Synopsys

Rethinking Machine Learning For Power
By Brian Bailey - 13 Sep, 2022 - Comments: 0

The power consumed by machine learning is exploding, and while advances are being made in reducing the power consumed by them, model sizes and training sets are increasing even faster. Even with the introduction of fabrication technology advances, specialized architectures, and the application of optimization techniques, the trend is disturbing. Couple that with the explosion in edge devices... » read more

Designing For Thermal
By Karen Heyman - 13 Sep, 2022 - Comments: 0

Heat has emerged as a major concern for semiconductors in every form factor, from digital watches to data centers, and it is becoming more of a problem at advanced nodes and in advanced packages where that heat is especially difficult to dissipate. Temperatures at the base of finFETs and GAA FETs can differ from those at the top of the transistor structures. They also can vary depending on h... » read more

Week In Review: Design, Low Power
By Jesse Allen - 09 Sep, 2022 - Comments: 0

Revenue for the top 10 IC design houses globally hit US$ 39.6 billion in 2Q22, a 32% growth over the prior year, according to a Trendforce report. The firm contends this growth trend will be difficult to maintain due to the high preceding base period and overall worse market conditions. Renesas introduced a RISC-V MCU specifically optimized for advanced motor control systems. The new ASSP in... » read more

Test Data Streaming For The Next Generation Of Designs
By Rahul Singhal - 08 Sep, 2022 - Comments: 0

Semiconductor chips have been evolving to meet the demands of rapidly transforming applications, and so has the test technology to meet the test goals of those chips. Going back two decades or so, the applications were limited and the designs were simpler, thus the concerns about power, performance and area (PPA), turn-around time, re-use and time-to-market, etc., were important but not as crit... » read more

Enabling Test Strategies For 2.5D, 3D Stacked ICs
By Laura Peters - 08 Sep, 2022 - Comments: 0

Improved testability, coupled with more tests at more insertion points, are emerging as key strategies for creating reliable, heterogeneous 2.5D and 3D designs with sufficient yield.  Many changes need to fall into place to make side-by-side 2.5D and 3D stacking approaches cost-effective, particularly for companies looking to integrate chiplets from different vendors. Today, nearly all of t... » read more

The Drive Toward More Predictive Maintenance
By Anne Meixner - 08 Sep, 2022 - Comments: 0

Maintenance is a critical behind-the-scenes activity that keeps manufacturing facilities running and data centers humming. But when not performed in a timely manner, it can result in damaged products or equipment, or significant system/equipment downtime. By shifting from scheduled maintenance to predictive maintenance, factories and electronic system owners can reap substantial benefits, in... » read more

Better, Faster, And More Efficient Verification With The Power Of AI
By Synopsys - 07 Sep, 2022 - Comments: 0

Verification is often the most challenging part of the chip development process. Verification engineers have to balance quality of results (QOR) with time to results (TTR) and cost of results (COR). AI and ML technologies can play a significant part in increasing QOR, speeding up TTR, and reducing COR. This white paper outlines some of the major challenges for verification, describes how AI pro... » read more

Blog Review: Sept. 7
By Jesse Allen - 07 Sep, 2022 - Comments: 0

Cadence's Paul McLellan shares highlights from the recent Hot Chips tutorial on CXL and how enhanced memory pooling enables new memory usage models as CXL 3.0 approaches the same speed as DRAM. Synopsys' Sam Tennent and Kamal Desai highlight the emergence of virtual prototyping, its synergy with continuous integration and development setups, and the benefits when these disciplines are combin... » read more

Challenges Mount In New Autos
By John Koon - 06 Sep, 2022 - Comments: 0

Electronics are becoming the primary differentiator for carmakers, adding an array of options that can alter everything from how a vehicle's occupants interact with their surroundings to how the vehicle drives. But the infrastructure needed to support these features also raises a slew of technology and business questions for which there are no simple answers today. For example, how will new ... » read more

Week In Review: Design, Low Power
By Marie C. Baca - 02 Sep, 2022 - Comments: 0

Trade regulations/legal The U.S. government placed new restrictions on sales of GPUs to China that could be used for high-performance computing, artificial intelligence, and other advanced applications. NVIDIA said in an SEC filing Wednesday that officials told the company it must seek an export license for sales to China or Russia of its A100 and H100 chips, and any system that includes those... » read more

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