tag: Synopsys

Customizing Processors
By Brian Bailey - 28 Jul, 2022 - Comments: 1

The design, verification, and implementation of a processor is the core competence of some companies, but others just want to whip up a small processor as quickly and cheaply as possible. What tools and options exist? Processors range from very small, simple cores that are deeply embedded into products to those operating at the highest possible clock speeds and throughputs in data centers. I... » read more

Distilling The Essence Of Four DAC Keynotes
By Brian Bailey - 28 Jul, 2022 - Comments: 0

Chip design and verification are facing a growing number of challenges. How they will be solved — particularly with the addition of machine learning — is a major question for the EDA industry, and it was a common theme among four keynote speakers at this month's Design Automation Conference. DAC has returned as a live event, and this year's keynotes involved the leaders of a systems comp... » read more

TCAD-Based Radiation Modeling Technique For Reliable Aerospace Chips
By Ian Land - 28 Jul, 2022 - Comments: 0

By Ian Land and Ricardo Borges We demand a lot from the electronic components that bring our devices and systems to life. This is particularly true when it comes to semiconductors for space applications. From satellites to spacecraft, aerospace and defense equipment must tolerate the most extreme of operating conditions in order to perform their jobs safely and reliably. How do you ensure... » read more

Custom Compiler Technology Highlights from 2022.06 Release
By Synopsys - 27 Jul, 2022 - Comments: 0

Weikai Sun, VP of Engineering at Synopsys, highlights the key technologies in Custom Compiler’s latest release. He shows how Synopsys’ innovative solutions for design closure, layout automation and emerging applications are increasing the productivity of design teams. Click here to access the  video white paper. » read more

Blog Review: July 27
By Jesse Allen - 27 Jul, 2022 - Comments: 0

Siemens' Keith Felton expects a greater emphasis on several areas of semiconductor package design next year, including accelerated growth of heterogeneous integration, multiple die, and chiplet SiPs, emergence and adoption of organic-based interposers, and early detection of thermal and electromechanical issues. Cadence's Paul McLellan visits Imec to find out about getting the heat out of 3D... » read more

Near-Threshold Computing Gets A Boost
By Brian Bailey - 25 Jul, 2022 - Comments: 0

Near-threshold computing has long been used for power-sensitive devices, but some surprising, unrelated advances are making it much easier to deploy. While near-threshold logic has been an essential technique for applications with the lowest power consumption, it always has been difficult to use. That is changing, and while it is unlikely to become a mainstream technique, it is certainly bec... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 22 Jul, 2022 - Comments: 0

Security Flex Logix Technologies is partnering with Intrinsic ID to secure and protect any device using its eFPGA, so the device can’t be modified maliciously, through physical attacks or remote hacking. Flex Logix’s EFLX ePFGA will have Intrinsic ID’s SRAM physical unclonable function (PUF), a military-grade security IP that gives a device a unique silicon ID. The ID secures confidentia... » read more

Telecare Challenges: Secure, Reliable, Lower Power
By John Koon - 20 Jul, 2022 - Comments: 0

The adoption of telecare using a variety of connected digital devices is opening the door to much more rapid response to medical emergencies, as well as more consistent monitoring, but it also is adding new challenges involving connectivity, security, and power consumption. Telecare has been on the horizon for the better part of two decades, but it really began ramping with improvements in s... » read more

Blog Review: July 20
By Jesse Allen - 20 Jul, 2022 - Comments: 0

Synopsys' Ron Lowman examines the various neural networks used in camera applications, the balancing act between camera lens choice and neural networks implemented, and how IP and embedded vision processors help optimize the designs. Siemens' Katie Tormala considers the importance of acoustic performance in consumer electronics and why it's important to understand the relationships between t... » read more

Heterogenous Integration Creating New IP Opportunities
By Brian Bailey - 19 Jul, 2022 - Comments: 0

The design IP market has long been known for constant change and evolution, but the industry trend toward heterogenous integration and chiplets is creating some new challenges and opportunities. Companies wanting to stake out a claim in this area have to be nimble, because there will be many potential standards introduced, and they are likely to change quickly as the industry explores what is r... » read more

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