tag: system-level test

Journey From Cell-Aware To Device-Aware Testing Begins
By Laura Peters - 06 Jun, 2023 - Comments: 0

Early results of using device-aware testing on alternative memories show expanded test coverage, but this is just the start. Once the semiconductor industry realized that it was suffering from device failures even when test programs achieved 100% fault coverage, it went about addressing this disconnect between the way defects manifest themselves inside devices and the commonly used fault mod... » read more

Optimizing Scan Test For Complex ICs
By Gregory Haley - 09 May, 2023 - Comments: 0

As chips become more heterogeneous with more integrated functionality, testing them presents increasing challenges — particularly for high-speed system-on-chip (SoC) designs with limited test pin availability. In addition, the complexity of emerging packages like 3D and chiplets necessitates comprehensive new solutions that can provide faster results at multiple stages in the silicon lifec... » read more

Advanced Digital Process Nodes Drive Semiconductor Test Innovations
By Regan Mills - 07 Mar, 2023 - Comments: 0

Global internet traffic is growing exponentially, with no sign of slowing, and this demand is driving the evolution of the semiconductor industry. The appetite for more and more data requires sensors for capturing the data, networks for moving the data, storage, and processing power to analyze the data. As the demand for data grows, the underlying technologies must advance to not only meet toda... » read more

Hunting For Hardware-Related Errors In Data Centers
By Anne Meixner - 07 Feb, 2023 - Comments: 2

The semiconductor industry is urgently pursuing design, monitoring, and testing strategies to help identify and eliminate hardware defects that can cause catastrophic errors. Corrupt execution errors, also known as silent data errors, cannot be fully isolated at test — even with system-level testing — because they occur only under specific conditions. To sort out the environmental condit... » read more

Scan Pattern Portability From PSV To ATE To SLT To IST
By Ash Patel - 30 Jan, 2023 - Comments: 0

By Ash Patel and Karthik Natarajan Chip testing has become increasingly complex due to the number of variables impacting designs – from design size and complexity, to high transistor counts on advanced technology nodes, to 2.5D/3D packaging, to manufacturing variability. All of these combine to make testing today's chips and packages more complicated than ever before. The number of test pa... » read more

Screening For Silent Data Errors
By Anne Meixner - 10 Jan, 2023 - Comments: 0

Engineers are beginning to understand the causes of silent data errors (SDEs) and the data center failures they cause, both of which can be reduced by increasing test coverage and boosting inspection on critical layers. Silent data errors are so named because if engineers don’t look for them, then they don’t know they exist. Unlike other kinds of faulty behaviors, these errors also can c... » read more

Emerging Technologies Are Driving System Level Test Adoption
By Natalian Z. Der - 10 Jan, 2023 - Comments: 0

With the size of semiconductor transistors decreasing and chip complexity increasing exponentially, semiconductor test has become essential to ensuring that only high-quality products go to market. With the introduction of more rigorous acceptable quality level (AQL) certifications, test methods must constantly evolve to meet these standards, and system level test (SLT) and traditional test... » read more

System Level Test — A Primer: White Paper
By Teradyne - 10 Jan, 2023 - Comments: 0

As semiconductor geometries become smaller and greater complexity is pushed into chips or packages, System Level Test (SLT) is becoming essential. Peter Reichert, System Architect for Teradyne’s System Level Test division discusses what System Level Test is, and how it can improve final product quality and reduce time to market. Click here to download the white paper. » read more

Silent Data Corruption
By Ed Sperling - 12 Dec, 2022 - Comments: 0

Defects can creep into chip manufacturing from anywhere, but the problem is getting worse at advanced nodes and in advanced packages where reduced pin access can make testing much more difficult. Ira Leventhal, vice president of U.S. Applied Research and Technology at Advantest America, talks about what’s causing these so-called silent data errors, how to find them, and why it now requires ma... » read more

Leverage Functional Interfaces For High-Speed Test Access During All Phases Of The Silicon Lifecycle
By Ash Patel - 12 Jul, 2022 - Comments: 0

Chip testing used to be straightforward. The development team used fault simulation to select a subset of the functional tests that could detect most possible manufacturing faults. These were translated to test patterns that ran on automated test equipment (ATE) to screen out defective dies at wafer test and bad packaged chips in final test. Lots of new technology was introduced over time, incl... » read more

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