IEDM Keynote: Ann Kelleher On Future Technology

By Paul McLellan - 21 Dec, 2022 - Comments: 0

IEDM 2022 celebrated 75 Years of the Transistor. I can't imagine anything else invented in the last 75 years has had as much effect on my life, and probably yours, too. After the awards session, the conference got underway with a keynote by Ann Kelleher, Executive Vice President and General Manager of Technology Development at Intel. It was titled "Celebrating 75 Years of the Transistor! A L... » read more

What’s Next For Transistors And Chiplets

By Mark LaPedus - 21 Oct, 2021 - Comments: 5

Sri Samavedam, senior vice president of CMOS Technologies at Imec, sat down with Semiconductor Engineering to talk about finFET scaling, gate-all-around transistors, interconnects, packaging, chiplets and 3D SoCs. What follows are excerpts of that discussion. SE: The semiconductor technology roadmap is moving in several different directions. We have traditional logic scaling, but packaging i... » read more

Architecting Interposers

By Brian Bailey - 14 Oct, 2021 - Comments: 0

An interposer performs a similar function as a printed circuit board (PCB), but when the interposer is moved inside a package the impact is significant. Neither legacy PCB nor IC design tools can fully perform the necessary design and analysis tasks. But perhaps even more important, adding an interposer to a design may require organizational changes. Today, leading-edge companies have shown ... » read more

Shifting Left: Early Multi Physics Analysis For STCO

By Per Viklund - 24 Jun, 2021 - Comments: 0

With the economics of transistor scaling no longer universally applicable, the industry is turning to innovative packaging technologies to support system scaling demands and achieve lower system cost. This has led to the emergence of a system technology co-optimization (STCO) approach, in which an SoC is disaggregated into smaller modules (also known as chiplets) that can be asynchronously desi... » read more

Using A System Technology Co-Optimization (STCO) Approach For 2.5/3D Heterogeneous Semiconductor Integration

By Siemens EDA - 23 Jun, 2021 - Comments: 0

With the economics of transistor scaling no longer universally applicable, the industry is turning to innovative packaging technologies to support system scaling demands and achieve lower system cost. This has led to the system technology co-optimization (STCO) concept, where a SoC type system is disaggregated, or partitioned, into smaller modules (also known as chiplets) that can be asynchrono... » read more

Extending The IC Roadmap

By Mark LaPedus - 11 Jun, 2018 - Comments: 0

An Steegen, executive vice president of semiconductor technology and systems at Imec, sat down with Semiconductor Engineering to discuss IC scaling and chip packaging. Imec is working on next-generation transistors, but it is also developing several new technologies for IC packaging, such as a proprietary silicon bridge, a cooling technology and packaging modules. What follows are excerpts of t... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer