tag: Texas A&M University

Hardware Fuzzer Utilizing LLMs
By Technical Paper Link - 12 Apr, 2024 - Comments: 0

A new technical paper titled "Beyond Random Inputs: A Novel ML-Based Hardware Fuzzing" was published by researchers at TU Darmstadt and Texas A&M University. Abstract "Modern computing systems heavily rely on hardware as the root of trust. However, their increasing complexity has given rise to security-critical vulnerabilities that cross-layer at-tacks can exploit. Traditional hardware ... » read more

Chip Industry Technical Paper Roundup: Mar. 5
By Linda Christensen - 05 Mar, 2024 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=201 /] » read more

Chip Industry Week In Review
By The SE Staff - 01 Mar, 2024 - Comments: 0

By Adam Kovac, Karen Heyman, and Liz Allan. India approved the construction of two fabs and a packaging house, for a total investment of about $15.2 billion, according to multiple sources. One fab will be jointly owned by Tata and Taiwan's Powerchip. The second fab will be a joint investment between CG Power, Japan's Renesas Electronics, and Thailand's Stars Microelectronics. Tata will run t... » read more

White-Box Fuzzer With Static Analysis To Detect And Locate Timing Vulnerabilities In RISC-V Processors 
By Technical Paper Link - 20 Feb, 2024 - Comments: 0

A technical paper titled “WhisperFuzz: White-Box Fuzzing for Detecting and Locating Timing Vulnerabilities in Processors” was published by researchers at Indian Institute of Technology Madras, Texas A&M University, and Technische Universität Darmstadt. Abstract: "Timing vulnerabilities in processors have emerged as a potent threat. As processors are the foundation of any computing s... » read more

Chip Industry’s Technical Paper Roundup: Dec 11
By Liz Allan - 11 Dec, 2023 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=174 /] More ReadingTechnical Paper Library home » read more

Chip Industry Week In Review
By The SE Staff - 08 Dec, 2023 - Comments: 0

By Jesse Allen, Karen Heyman, and Liz Allan AMD took the covers off new AI accelerators for training and inferencing of large language model and high-performance computing workloads. In its announcement, AMD focused heavily on performance leadership in the commercial AI processor space through a combination of architectural changes, better software efficiency, along with some improvements in... » read more

How Different Metal Depositions Affect The Structure And Charge Transport Of 9-A Graphene Nanoribbons
By Technical Paper Link - 06 Dec, 2023 - Comments: 0

A technical paper titled “Contact engineering for graphene nanoribbon devices” was published by researchers at University of Arizona, Swiss Federal Labs for Materials Science and Technology, University of California Berkeley, Stanford University, SRM Institute of Science and Technology, Texas A&M University, Lawrence Berkeley National Laboratory (LBNL), Max Planck Institute for Polymer... » read more

Hardware Fuzzing With MAB Algorithms
By Technical Paper Link - 05 Dec, 2023 - Comments: 0

A technical paper titled “MABFuzz: Multi-Armed Bandit Algorithms for Fuzzing Processors” was published by researchers at Texas A&M University and Technische Universitat Darmstadt. Abstract: "As the complexities of processors keep increasing, the task of effectively verifying their integrity and security becomes ever more daunting. The intricate web of instructions, microarchitectural ... » read more

Tapping 2D van der Waals Ferroelectrics For Use In Next-Generation Electronics
By Technical Paper Link - 05 Dec, 2023 - Comments: 0

A technical paper titled “Domain-dependent strain and stacking in two-dimensional van der Waals ferroelectrics” was published by researchers at Rice University, Massachusetts Institute of Technology, University of Texas at Arlington, Texas A&M University, and Pennsylvania State University. Abstract: "Van der Waals (vdW) ferroelectrics have attracted significant attention for their pot... » read more

Research Bits: November 21
By Jesse Allen - 21 Nov, 2023 - Comments: 0

MoS2 in-memory processor Researchers from École Polytechnique Fédérale de Lausanne (EPFL) developed a large-scale in-memory processor using the 2D semiconductor material, molybdenum disulfide (MoS2), for the channel material in the more than 1,000 transistors that comprise the processor. The MoS2-based in-memory processor is dedicated to vector-matrix multiplication, key for digital signal ... » read more

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