Behind The Analog Frenzy


Analog is suddenly very hot again, and much of it appears to be due to the promise of 2.5D and 3D stacking. Texas Instruments pulled out its checkbook to pay $6.5 billion for National Semiconductor, and Microsemi has offered $28 million for AML Communications, which makes low-noise and high-power microwave amplifiers. So what’s behind these move? In TI’s case, there appears to be a re... » read more

Gene’s Law Meets EDA


By Pallab Chatterjee What will be the next major improvement that will cut power levels by an order of magnitude? That question was the basis of a roundtable discussion at the recent ISSC conference. Current technology provides incremental improvements each year, but the next generation of electronic systems will require dramatic changes and innovation. This premise is based on Gene’s Law... » read more

Qualcomm Shies Away From High-k At 28nm


By David Lammers Qualcomm CDMA Technologies said it will not use a high-k/metal gate (HKMG) process for most of the chips it makes at the 28 nm node, sticking with a poly/SiON gate stack. The company described the rationale behind the strategy, which because of Qualcomm’s size will have a major impact on the foundry business, at the 2010 International Electron Devices Meeting (IEDM) held in ... » read more

Reducing Bottlenecks


By Ann Steffora Mutschler For the first time ever, China recently earned fastest supercomputer bragging rights with its Tianhe-1A supercomputer, which can perform 2.57 quadrillion computing operations per second. The machine has been successfully used to survey mines, forecast weather and design high-end machinery. While it has caused concern, it is important to note that the Tianhe-1A use... » read more

The Trouble With Low-Power Verification


By Ed Sperling If verification accounts for 70% of the non-recurring engineering expenses in a design, what percentage does verifying a low-power design actually consume? Answer: No one knows for sure. The reason has more to do with insufficient data than tools, processes or flows. That’s also the reason that power models have never been created for more than a single design. “Power... » read more

Moving To Open-Source Software


By Ann Steffora Mutschler With the typical cost of software accounting for 40% to 60% of an SoC, semiconductor OEMs are under more pressure than ever to meet margins. As a result, they are drawing on their ecosystem partners to provide a more complete foundation including hardware, software, FPGA prototypes, verification IP and virtual models, as well as an increasing demand for open source so... » read more

EUV Focus Shifts To Affordability


By David Lammers Over the past year, key technologists in the semiconductor industry have come around to believing that EUV lithography will be available for critical mask layers in the next three to five years. What is still up for debate is whether EUV will be cost-effective for low-power consumer SoCs. To penetrate that cost-sensitive market, EUV must overcoming hurdles presented by masks, ... » read more

Make vs. Buy


By Ann Steffora Mutschler The age-old question of whether to make or buy is time immemorial, and is particularly true for the cyclical semiconductor industry. At the end of the day, the answer comes down to how the decision maker feels about having or losing control. Fifteen years ago, whether to make or buy something—be it the design, libraries, memory, implementation, verification, te... » read more

Smart-Grid Designs Solve Low-Power Riddles


By Ellen Konieczny Imagine that you go to your kitchen to get a drink and pass your home’s energy-usage monitor. Due to a recent heat wave, you see that your energy usage is already at what it usually is for the entire month. Yet you’ve still got one week left in your billing cycle. To keep the bill low, you turn your A/C thermostat up a degree and make a mental note to not keep lights o... » read more

Stacked Dies Gain Attention, But So Far Little Traction


By Ed Sperling For the better part of two decades there has been a steady stream of predictions about the abrupt end of Moore’s Law, but it now appears the formula for doubling the number of transistors on a die every couple years will simply dissipate rather than fall off a cliff. While companies such as Intel and IBM continue to develop road maps that extend their road maps all the wa... » read more

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