tag: thermal simulation

Using Real Workloads To Assess Thermal Impacts
By Ann Mutschler - 14 Dec, 2023 - Comments: 0

Thermal analysis is being driven much further left in the design, fueled by demand for increased transistor density and more features on a chip or in a package, as well as the unique ways the various components may be exercised or stressed. However, getting a clear picture of the thermal activity in advanced-node chips and packages is extremely complex, and it can vary significantly by use c... » read more

LAB Flip Chip Reflow Process Robustness Prediction By Thermal Simulation
By Gabriel Chang - 16 Nov, 2023 - Comments: 0

By Gabriel Chang and Ricky Zang Nowadays, there are many interconnects in IC chips. One of the packaging goals is to connect an IC to the next level of subsystem circuitry (package substrates/print circuit boards). Mass reflow (MR) of solder joints is a widely adapted and stable process in the industry. The applications of MR include flip chip, ball mounting, surface mount technology (SMT), ... » read more

Thermal Warpage Simulation Of A Temperature-Dependent Linear Elastic Material Package
By Cadence - 08 Nov, 2023 - Comments: 0

The shift to advanced packaging in 3D and 2.5D IC design is making the numerical analysis of thermal warpage in electronic devices a crucial part of the design process. A reliable numerical tool enables the designer to perform early design analysis that accurately predicts warpage, thereby shortening the design process. The Cadence Celsius Thermal Solver integrated within the Cadence IC, pac... » read more

3D-IC: Operator Learning Framework For Ultra-Fast 3D Chip Thermal Prediction Under Multiple Chip Design Configurations
By Technical Paper Link - 24 Mar, 2023 - Comments: 0

A new technical paper titled "DeepOHeat: Operator Learning-based Ultra-fast Thermal Simulation in 3D-IC Design" was published (preprint) by researchers at UCSB and Cadence. Abstract "Thermal issue is a major concern in 3D integrated circuit (IC) design. Thermal optimization of 3D IC often requires massive expensive PDE simulations. Neural network-based thermal prediction models can perform ... » read more

Thermal Simulation Of DSMBGA And Coupled Thermal-Mechanical Simulation Of Large Body HDFO
By Nathan Whitchurch - 15 Sep, 2022 - Comments: 0

Electronic packaging has continued to become more complex with higher device count, higher power densities and Heterogeneous Integration (HI) becoming more common. In the mobile space, systems that were once separate components on a printed circuit board (PCB) have now been relocated along with all their associated passive devices and interconnects into single System in Package (SiP) style suba... » read more

Thermal Cycling Failure In Electronics
By Kelly Morgan - 19 Jul, 2022 - Comments: 0

Each time a device is turned off and on, its temperature changes. (Just think about how often your phone lights up all day.) Energy flowing through several layers of tightly stacked materials causes devices to heat up, then rapidly cool down. This repeated oscillation between temperatures over the lifetime of a device is called thermal cycling. Why thermal management is important Thermal cycl... » read more

Celsius Thermal Solver
By Cadence - 25 Sep, 2019 - Comments: 0

The Celsius Thermal Solver environment enables all aspects of thermal analysis to quickly and accurately identify thermal problems in IC packages, PCBs, and electronics systems. It features an innovative massive parallel solver technology that enables simulation speeds up to 10 times faster than conventional thermal simulators, with significantly reduced memory usage. It includes a powerful fin... » read more

Process Variation Not A Solved Issue
By Ann Mutschler - 09 Aug, 2018 - Comments: 4

Semiconductor Engineering sat down to talk about process variation in advanced nodes, and how design teams are coping, with Christoph Sohrmann, a member of the Advanced Physical Verification group in Fraunhofer’s Division of Engineering of Adaptive Systems (EAS); Juan Rey, vice president of engineering at Mentor, A Siemens Business; and Stephen Crosher, CEO of Moortec Semiconductor. What foll... » read more

3D Thermal Simulation Of Resistive Heating
By Robin Bornoff - 29 Oct, 2015 - Comments: 0

Joule heating, also known as resistive or Ohmic heating, is the power lost to heat as electrical current flows down a conductor. We were introduced to Joule’s first law (Power dissipation = I²R, VI, V²/R) way back in high school. From an electronics thermal simulation perspective it requires a full 3D electrical flow simulation to be conducted, and from that the Joule heating power dissipat... » read more

How To Get The Most Power While Being Cool To The Touch
By Robin Bornoff - 09 Jul, 2015 - Comments: 0

Traditional electronics thermal management in high power applications such as telecommunication, networking, and computing involves keeping the operating junction temperatures at, or below, maximum rated values for the intended application, often with fans, blowers, heatsinks, etc. Mobile consumer electronics also have to be thermally managed to ensure that when a person uses the product, ‘to... » read more

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