Using Palladium To Address Contact Issues Of Buried Oxide Thin Film Transistors


A new technical paper titled "Approach to Low Contact Resistance Formation on Buried Interface in Oxide Thin-Film Transistors: Utilization of Palladium-Mediated Hydrogen Pathway" was published by researchers at Tokyo Institute of Technology and National Institute for Materials Science (NIMS). Abstract "Amorphous oxide semiconductors (AOSs) with low off-currents and processing temperatures... » read more

Using The Schottky Barrier Transistor in Various Applications & Material Systems


A new technical review paper titled "The Schottky barrier transistor in emerging electronic devices" was published by researchers at THM University of Applied Sciences, Chalmers University of Technology, CNRS, University Grenoble Alpes and others. Abstract "This paper explores how the Schottky barrier (SB) transistor is used in a variety of applications and material systems. A discussion of... » read more

Stretchability of Integrated Thin Film Transistors (TFT)


A new technical paper titled "High density integration of stretchable inorganic thin film transistors with excellent performance and reliability" was published by researchers at Electronics and Telecommunications Research Institute (ETRI) in Korea. "In this study, we show high density integration of oxide thin film transistors having excellent performance and reliability by directly embeddin... » read more

Nanosheet GeSn pTFTs: High Performance, Low Thermal Budget


New technical paper titled "Remarkably High-Performance Nanosheet GeSn Thin-Film Transistor" from researchers at National Yang Ming Chiao Tung University and others. Abstract "High-performance p-type thin-film transistors (pTFTs) are crucial for realizing low-power display-on-panel and monolithic three-dimensional integrated circuits. Unfortunately, it is difficult to achieve a high hole ... » read more

Large-area photonic lift-off process for flexible thin-film transistors


Abstract "Fabricating flexible electronics on plastic is often limited by the poor dimensional stability of polymer substrates. To mitigate, glass carriers are used during fabrication, but removing the plastic substrate from a carrier without damaging the electronics remains challenging. Here we utilize a large-area, high-throughput photonic lift-off (PLO) process to rapidly separate polymer f... » read more

The “Natively Flexible” Processor Has Arrived: Here’s What We Need To Make It Mainstream


The microprocessor is one of history’s pivotal inventions, ranking in influence with breakthroughs such as the wheel, the transistor, and the printing press. There is no escaping their popularity or usefulness either: with tens of billions of processors produced each year they have revolutionized industries such as health care, media, retail, transportation, and of course information manageme... » read more

Another Dimension For Virtual Reality


When you put on a virtual reality (VR) headset, you are connecting visually to another place—real or imagined. Most people connect VR with gaming, but increasingly business, industry and government users are finding new applications for the evolving technology. These applications, and many more to come, will help drive the adoption of VR and the devices used to access virtual environments. ... » read more