tag: traceability

Smart Test Collides With The Data Chain
By Gregory Haley - 12 May, 2026 - Comments: 0

Key Takeaways: The promise of smart test is a data-chain problem before it is an algorithm problem. A device can pass every checkpoint and still carry a latent defect the test record never captured. As test grows more adaptive, the validity of the measurement environment matters as much as the measurement itself. For years, the test roadmap has pointed toward more adaptive f... » read more

Untrusted Analog Components Add Risks For Critical Infrastructure
By Anne Meixner - 07 Apr, 2026 - Comments: 0

Key Takeaways New certificate-based solutions are necessary within fabs and packaging houses to deliver trusted semiconductors. Physical IDs bind the device to the certificate, but it needs to be immutable and unclonable. Extrinsic IDs are required for analog, mixed-signal, sensor ICs as well as discrete components. Rising concern over the source and destination of chips, an... » read more

Advanced Packaging Traceability And Root Cause Analysis
By Aftkhar Aslam - 20 Nov, 2025 - Comments: 0

The semiconductor industry is undergoing a profound transformation. What once centered on single-die silicon packaged in QFN or BGA formats has evolved into a landscape of multi-die integration, chiplets, 3D stacking, and photonics coupling. These advanced packaging architectures are redefining design, manufacturing, and test paradigms—enabling new levels of performance, efficiency, and funct... » read more

Infusing Trust Into The Supply Chain
By Anne Meixner - 09 Sep, 2025 - Comments: 0

An expanding supply chain of dies feeding multi-die products is prompting chipmakers to reassess and expand on ways to instill trust from end to end. This reaches deeper than just connecting disparate data. It requires integrating complex systems across vendors and protecting vendor data while instilling confidence in their customers and partners. Yet despite the time and effort that has bee... » read more

Cyber Threats Multiply With Commercial Chiplets
By Ann Mutschler - 01 May, 2025 - Comments: 0

The commercialization of chiplets will significantly boost the potential for attacks on hardware, requiring a much broader set of security measures and processes at every level of the supply chain, including traceability from initial design to end of life. Much progress has been made in recent years on security measures, including everything from identifying unusual data traffic inside a chi... » read more

Integrating Data From Design, Manufacturing, And The Field
By Adam Kovac - 13 Mar, 2025 - Comments: 0

Chip design is starting to include more options to ensure chips behave reliably in the field, boosting the ability to tweak both hardware and software as chips age. The basic problem is that as dimensions become smaller, and as more features are added into devices — especially with heterogeneous assemblies of chiplets running some type of AI — the potential for thermally induced structur... » read more

SLM Evolves Into Critical Aspect Of Chip Design And Operation
By Ann Mutschler - 19 Dec, 2024 - Comments: 0

Silicon lifecycle management has evolved greatly in the past five years, moving from novel concept to a key part of design flows at industry leaders such as NVIDIA, Amazon Web Services, Ericsson, and others. Along with becoming a major focus for companies developing semiconductors, the use cases have expanded. While initially focused on post-silicon insights, SLM has expanded to cover the en... » read more

New Strategies For Interpreting Data Variability
By Gregory Haley - 09 Apr, 2024 - Comments: 0

Every measurement counts at the nanoscopic scale of modern semiconductor processes, but with each new process node the number of measurements and the need for accuracy escalate dramatically. Petabytes of new data are being generated and used in every aspect of the manufacturing process for informed decision-making, process optimization, and the continuous pursuit of quality and yield. Most f... » read more

Plugging Gaps In The IC Supply Chain
By Anne Meixner - 09 Jan, 2024 - Comments: 0

Multiple touch points in manufacturing and packaging are exposing gaps in the data used to track different components, making it difficult to identify the source of issues that can affect yield and reliability, and opening the door to counterfeit or sub-standard parts. This involves more than just assigning a simple identifying code to a chip. At different points in a device's lifecycle, new... » read more

Fingerprinting Chips For Traceability
By Anne Meixner - 12 Dec, 2023 - Comments: 0

Semiconductor components increasingly require unclonable and tamper resistant identifiers, which are especially necessary as devices become increasingly heterogeneous collections of chiplets and subsystems. These fingerprints provide traceability, which contributes to process improvements and yield learning and enable tracking for a tightly managed supply chain. While some of this technology... » read more

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