tag: UCIe

Closing The Test And Metrology Gap In 3D-IC Packages
By Gregory Haley - 12 Dec, 2023 - Comments: 0

The industry is investing in more precise and productive inspection and testing to enable advanced packages and eventually, 3D ICs. The next generations of aerospace, automotive, smartphone, and wearable tech most likely will be powered by multiple layers of intricately connected silicon, a stark departure from the planar landscapes of traditional integrated circuits. These 3D-ICs, compos... » read more

3D-ICs May Be The Least-Cost Option
By Brian Bailey - 30 Nov, 2023 - Comments: 1

When 2.5D and 3D packaging were first conceived, the general consensus was that only the largest semiconductor houses would be able to afford them, but development costs are quickly coming under control. In some cases, these advanced packages actually may turn out to be the lowest-cost options. With stacked die [1], each die is considered to be a complete functional block or sub-system. In t... » read more

Nascent Chiplet Tech Gaining Attention In Defense and Commercial Industries
By Ben Miller - 30 Nov, 2023 - Comments: 0

The economic benefits derived from Moore's Law have changed, and not for the better. This shift – especially on the manufacturing side of system-on-chip (SoC) devices, has both the defense and commercial customers in the semiconductor industry wondering what will come next. One way to extend Moore's Law's cost, feature, and size benefits is with multi-chip technology, now commonly known as... » read more

Making Heterogeneous Integration More Predictable
By Ed Sperling - 29 Nov, 2023 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss problems and potential solutions in heterogeneous integration with Dick Otte, president and CEO of Promex Industries; Mike Kelly, vice president of chiplets/FCBGA integration at Amkor Technology; Shekhar Kapoor, senior director of product management at Synopsys; John Park, product management group director in Cadence's Custom I... » read more

Ensuring The Health And Reliability Of Multi-Die Systems
By Yervant Zorian - 26 Oct, 2023 - Comments: 0

From generative AI tools that rapidly produce chatbot responses to high-performance computing (HPC) applications enabling financial forecasting and weather modeling, it’s clear we’re in a whole new realm of processing power demand. Given these compute-intensive workloads, monolithic SoCs are no longer capable to meet today’s processing needs. Engineering ingenuity, however, has answered t... » read more

Heterogeneous Integration Finding Its Footing
By Ed Sperling - 19 Oct, 2023 - Comments: 0

Semiconductor Engineering sat down to discuss heterogeneous integration with Dick Otte, president and CEO of Promex Industries; Mike Kelly, vice president of chiplets/FCBGA integration at Amkor Technology; Shekhar Kapoor, senior director of product management at Synopsys; John Park, product management group director in Cadence's Custom IC & PCB Group; and Tony Mastroianni, advanced packagin... » read more

Why Using Commercial Chiplets Is So Difficult
By Ed Sperling - 18 Oct, 2023 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss use cases and challenges for commercial chiplets with Saif Alam, vice president of engineering at Movellus; Tony Mastroianni, advanced packaging solutions director at Siemens Digital Industries Software; Mark Kuemerle, vice president of technology at Marvell; and Craig Bishop, CTO at Deca Technologies. What follows are excerpts... » read more

Who Will Regulate Data Exchanges In Chiplets?
By Ed Sperling - 17 Aug, 2023 - Comments: 0

Scaling is still important when it comes to logic and low power, but it's no longer the main avenue for improving performance. What used to be a single chip, comprised of various IP blocks and components on a single SoC, is giving way to a heterogeneous collection of chiplets — at least for the big chipmakers and system companies at the leading edge. Chiplets are currently the best solutio... » read more

Enabling A Chiplet Supply Chain
By Vik Chaudhry - 17 Aug, 2023 - Comments: 0

Chiplets have been in the news quite a bit lately. A chiplet-based architecture offers several advantages that chip designers can benefit from as they bring out new products to the market. Over the years, system designers have integrated more and more functions into a system on chip (SoC). As a result, the size of SoCs keeps increasing. Even though SoCs provide several advantages in performance... » read more

Chiplets: Deep Dive Into Designing, Manufacturing, And Testing
By The SE Staff - 07 Aug, 2023 - Comments: 0

Chiplets are a disruptive technology. They change the way chips are designed, manufactured, tested, packaged, as well as the underlying business relationships and fundamentals. But they also open the door to vast new opportunities for existing chipmakers and startups to create highly customized components and systems for specific use cases and market segments. This LEGO-like approach sounds ... » read more

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