tag: UMC

The Week In Review: Design
By Jesse Allen - 17 Nov, 2017 - Comments: 0

Tools Aldec released the latest version of its Riviera-PRO verification platform, adding QEMU Bridge to enable hardware/software co-simulation of designs intended to run on SoC FPGAs. Other features include improved performance when using code containing many inline randomized calls and up to 29% faster simulation speed of UVM. Pulsic added new features to its Unity Bus Planner for planning... » read more

Variation Spreads At 10/7nm
By Ed Sperling - 16 Nov, 2017 - Comments: 6

Variation between different manufacturing equipment is becoming increasingly troublesome as chipmakers push to 10/7nm and beyond. Process variation is a well-known phenomenon at advanced nodes. But some of that is actually due to variations in equipment—sometimes the exact same model from the same vendor. Normally this would fall well below the radar of the semiconductor industry. But as t... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 03 Nov, 2017 - Comments: 0

Chipmakers Bloomberg has reported that Broadcom is in talks to acquire Qualcomm for $70 per share or about $90 billion. Qualcomm is attempting to acquire NXP, but Broadcom has its sights on Qualcomm, not NXP. “We think AVGO would want to acquire QCOM assets not NXP,” said Amit Daryanani, an analyst with RBC. Samsung continues to reshuffle its management amid a plethora of changes at t... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 27 Oct, 2017 - Comments: 0

Chipmakers At this week’s International Wafer-Level Packaging Conference (IWLPC), Samsung disclosed details about its efforts in the panel-level fan-out market. Samsung as well as ASE, Nepes and others are developing a next-generation fan-out technology using a panel-level format. In panel-level fan-out packaging, you can put more die on a panel as compared to a traditional round wafer, w... » read more

Radar Versus LiDAR
By Mark LaPedus - 23 Oct, 2017 - Comments: 6

Demand is picking up for vision, radar and LiDAR sensors that enable assisted and autonomous driving capabilities in cars, but carmakers are now pushing for some new and demanding requirements from suppliers. The automotive market always has been tough on suppliers. OEMs want smaller, faster and cheaper devices at the same or improved safety levels for both advanced driver-assistance systems... » read more

MEMS Market Shifting
By Ed Sperling - 19 Oct, 2017 - Comments: 0

The MEMS sector is beginning to look more promising, bolstered by new end-market demand and different packaging options that require more advanced engineering, processes and new materials. All of this points to higher selling prices, which are long overdue in this space. For years, the market for microelectromechanical systems was populated by too many companies vying for too few opportunit... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 06 Oct, 2017 - Comments: 0

Test, measurement and fab tools National Instruments (NI) has released a report that explores the future trends in the electronics industry. The report, called the NI Trend Watch 2018, looks at the technological advances and some of the biggest challenges engineers face in 2018. The report from NI looks at the following topics—machine learning; test challenges for 5G; IIoT; and effects of... » read more

5 Takeaways From SEMI’s SMC
By Mark LaPedus - 21 Sep, 2017 - Comments: 0

At the recent Strategic Materials Conference (SMC), there were a multitude of presentations on a number of subjects. The event, sponsored by SEMI, had presentations on the IC industry, market drivers, electronic materials and other subjects. In no particular order, here are my five takeaways from SMC: Materials M&A mania Last year, the IC industry experienced a dizzying array of merger ... » read more

What Happened To ReRAM?
By Mark LaPedus - 21 Sep, 2017 - Comments: 8

Resistive RAM (ReRAM), one of a handful of next-generation memories under development, is finally gaining traction after years of setbacks. Fujitsu and Panasonic are jointly ramping up a second-generation ReRAM device. In addition, Crossbar is sampling a 40nm ReRAM technology, which is being made on a foundry basis by China’s SMIC. And not to be outdone, TSMC and UMC recently put ReRAM on ... » read more

What’s After 7nm?
By Ed Sperling - 14 Sep, 2017 - Comments: 1

The rollout of 10/7nm was a long time coming, and for good reason. It's hard stuff, and chipmakers have to be ready to take a giant step forward with new processes, tools, and to deal with a slew of physical effects that no longer can be handled by just guard-banding a design. The big question is what's next, when it will happen, and how much it will cost. Preparing for the next process node... » read more

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