Chip Industry Technical Paper Roundup: June 10


New technical papers added to Semiconductor Engineering’s library this week. [table id=232 /] More ReadingTechnical Paper Library home » read more

CMOS ICs for 77 GHz Automotive Radar


A new technical paper titled "CMOS IC Solutions for the 77 GHz Radar Sensor in Automotive Applications" was published by researchers at STMicroelectronics and University of Catania. Abstract "This paper presents recent results on CMOS integrated circuits for automotive radar sensor applications in the 77 GHz frequency band. It is well demonstrated that nano-scale CMOS technologies are the b... » read more

Chip Industry’s Technical Paper Roundup: May 8


New technical papers recently added to Semiconductor Engineering’s library: [table id=102 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us... » read more

Ethernet-Based In-Car Networking and Trends in Automotive Communications


A technical paper titled "A Perspective on Ethernet in Automotive Communications—Current Status and Future Trends" was published by researchers at University of Catania. Abstract "Automated driving requires correct perception of the surrounding environment in any driving condition. To achieve this result, not only are many more sensors than in current Advanced Driver Assistant Systems (AD... » read more

A Comparative Analysis of Computer-Aided Design Tools for Complex Power Electronics Systems


Abstract: "Companies working on semiconductors must currently assure the customers of not only the performance of the semiconductor device per se, but also its performance when it is implemented in a real board, therefore including the role of parasitic effects. It is therefore very important to evaluate, especially during the design phase, not only the single device, but the complete board ... » read more

Week In Review: Manufacturing, Test


Packaging Amkor plans to build a packaging plant in Bac Ninh, Vietnam. The first phase of the new factory will focus on providing system-in-package (SiP) assembly and test services for customers. The investment for the first phase of the facility is estimated to be between $200 million and $250 million. “This is a strategic, long-term investment in geographical diversification and factory... » read more