Chip Industry’s Technical Paper Roundup: Sept 19


New technical papers added to Semiconductor Engineering’s library this week. [table id=141 /] More Reading Technical Paper Library home » read more

Chip Industry Week In Review


By Gregory Haley, Jesse Allen, and Liz Allan TSMC told equipment vendors to delay deliveries of the most advanced tools due to uncertain demand, according to Reuters. The news drove down stock prices of all the major equipment providers. On the other hand, TSMC said advanced packaging shortages will constrain AI chip shipments for the next 18 months, according to NikkeiAsia. The United St... » read more

Formal Verification Of a Sequestered Encryption Architecture


A technical paper titled “Security Verification of Low-Trust Architectures” was published by researchers at Princeton University, University of Michigan, and Lafayette College. Abstract: "Low-trust architectures work on, from the viewpoint of software, always-encrypted data, and significantly reduce the amount of hardware trust to a small software-free enclave component. In this paper, we... » read more

Security Research: Technical Paper Round-up


A number of hardware security-related technical papers were presented at the August 2023 USENIX Security Symposium. Here are some highlights with associated links. [table id=130 /] A complete listing of all papers presented at this summer's USENIX conference can be found here and here. The organization provides open access research, and the presentation slides and papers are free to the p... » read more

Physical Removal Attack On LiDAR Sensors And Mitigation Strategies


A technical paper titled "You Can't See Me: Physical Removal Attacks on LiDAR-based Autonomous Vehicles Driving Frameworks" was published by researchers at University of Michigan, University of Florida and the University of Electro-Communications (Japan). This paper was included at the recent 32nd USENIX Security Symposium. Abstract: "Autonomous Vehicles (AVs) increasingly use LiDAR-base... » read more

Chip Industry’s Technical Paper Roundup: July 24


New technical papers recently added to Semiconductor Engineering’s library: [table id=119 /] More Reading Technical Paper Library home » read more

How To Fine-Tune Large-Area Molybdenum Disulfide Atomic Layer Deposition At 150°C


A technical paper titled "Toolbox of Advanced Atomic Layer Deposition Processes for Tailoring Large-Area MoS2 Thin Films at 150 °C" was published by researchers at Eindhoven University of Technology, University of Michigan, and University College Cork. Abstract: "Two-dimensional MoS2 is a promising material for applications, including electronics and electrocatalysis. However, scalable meth... » read more

Chip Industry’s Technical Paper Roundup: May 23


New technical papers recently added to Semiconductor Engineering’s library: [table id=104 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us... » read more

Memory Disaggregation Research And Making It Practical With Hardware Trends (U. of Michigan)


A new technical paper titled "Memory Disaggregation: Advances and Open Challenges" was published by researchers at University of Michigan. Abstract "Compute and memory are tightly coupled within each server in traditional datacenters. Large-scale datacenter operators have identified this coupling as a root cause behind fleet-wide resource underutilization and increasing Total Cost of Owners... » read more

Research Bits: May 2


Reconfigurable FeHEMT Researchers at the University of Michigan created a reconfigurable ferroelectric transistor that could enable a single amplifier to do the work of multiple conventional amplifiers. “By realizing this new type of transistor, it opens up the possibility for integrating multifunctional devices, such as reconfigurable transistors, filters and resonators, on the same plat... » read more

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