Heterogeneous Integration As A Path Towards Sustainable Computing, Using Chiplets


A technical paper titled "Towards Sustainable Computing: Assessing the Carbon Footprint of Heterogeneous Systems" was published by researchers at Arizona State University and University of Minnesota. Abstract: "Decades of progress in energy-efficient and low-power design have successfully reduced the operational carbon footprint in the semiconductor industry. However, this has led to an incre... » read more

Chip Industry’s Technical Paper Roundup: June 27


New technical papers added to Semiconductor Engineering’s library this week. [table id=113 /]   » read more

Improving Performance Of Artificial Intelligence And Quantum Computers


A technical paper titled “Gate-tunable superconducting diode effect in a three-terminal Josephson device” was published by researchers at University of Minnesota, University of California Santa Barbara, and Stanford University. Abstract: "The phenomenon of non-reciprocal critical current in a Josephson device, termed the Josephson diode effect, has garnered much recent interest. Realizati... » read more

Research Bits: May 23


DNA-based molecular computing Researchers at the University of Minnesota proposed a new method of biocomputing. Trumpet, or Transcriptional RNA Universal Multi-Purpose GatE PlaTform, uses biological enzymes as catalysts for DNA-based molecular computing. Researchers performed logic gate operations in test tubes using DNA molecules. A positive gate connection resulted in a phosphorescent glo... » read more

Week In Review: Design, Low Power


Arm advanced its progress toward an initial public offering, confidentially submitting a draft registration statement on Form F-1 to the U.S. Securities and Exchange Commission. The size and price range for the proposed offering have yet to be determined. Graphene IDM Paragraf acquired Cardea Bio, a maker of graphene-based biocompatible chips. Cardea has developed a biosignal processing unit... » read more

Chip Industry’s Technical Paper Roundup: Mar. 21


New technical papers recently added to Semiconductor Engineering’s library: [table id=88 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us ... » read more

New Spintronics Manufacturing Process, Allowing Scaling Down To Sub-5nm (U. of Minnesota/NIST)


A new technical paper titled "Sputtered L10-FePd and its Synthetic Antiferromagnet on Si/SiO2 Wafers for Scalable Spintronics" was published by researchers at University of Minnesota and NIST, with funding by DARPA and others. According to a University of Minnesota summary news article, "The industry standard spintronic material, cobalt iron boron, has reached a limit in its scalability. The... » read more

Manufacturing Bits: Oct. 27


Single-molecule switches A group of researchers have demonstrated a single-molecule switch or electret, a technology that could one day enable a new class of non-volatile memory storage devices. Yale University, Nanjing University, Renmin University, Xiamen University, and the Rensselaer Polytechnic Institute have demonstrated a single-molecule electret with functional memory. Still in ... » read more

Manufacturing Bits: Sept. 29


Exploring chemical reactions using EUV The University of Tokyo has established a facility to study fast chemical reactions using a coherent extreme ultraviolet light source. The new coherent extreme ultraviolet (XUV) source facility enables researchers to explore time-dependent phenomena, such as ultrafast chemical reactions of biological or physical samples. Located in an underground fa... » read more

Compute-In Memory Accelerators Up-End Network Design Tradeoffs


An explosion in the amount of data, coupled with the negative impact on performance and power for moving that data, is rekindling interest around in-memory processing as an alternative to moving data back and forth between the memory and the processor. Compute-in-memory (CIM) arrays based on either conventional memory elements like DRAM and NAND flash, as well as emerging non-volatile memori... » read more

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