Chip Industry Week In Review


Amkor will provide turnkey advanced packaging and test services to TSMC in Amkor's planned facility in Peoria, Arizona, in a deal announced on Thursday. The companies jointly specified the packaging technologies, such as TSMC’s Integrated Fan-Out (InFO) and Chip on Wafer on Substrate (CoWoS). President Biden signed into law a bill that exempts some semiconductor projects funded by the U.S.... » read more

Chip Industry Technical Paper Roundup: May 13


New technical papers added to Semiconductor Engineering’s library this week. [table id=225 /] More ReadingTechnical Paper Library home » read more

Leveraging LLMs To Explain EDA Synthesis Errors And Help Train New Engineers 


A technical paper titled “Explaining EDA synthesis errors with LLMs” was published by researchers at University of New South Wales and University of Calgary. Abstract: "Training new engineers in digital design is a challenge, particularly when it comes to teaching the complex electronic design automation (EDA) tooling used in this domain. Learners will typically deploy designs in the Veri... » read more

Research Bits: Mar. 11


Ferroelectric nanosheets Engineers from the University of Sydney, RMIT University, University of New South Wales, and University of Technology Sydney created a liquid metal alloy of tin, zirconium, and hafnium. The alloy has a thin oxide layer crust that enables it to be used to harvest ultra-thin tin oxide nanosheets doped with hafnium zirconium oxide, which could then be 2D printed on a subs... » read more

Startup Funding: February 2024


A startup developing AI chips dedicated to low-power AI inferencing captured one of the largest rounds of February. The startup, Recogni, already offers a low-power vision inferencing chip. Several other sizeable rounds were focused on the automotive space, with robotaxis, autonomous delivery, and the sensors that enable them. Another active area, power electronics drew funding for several c... » read more

Chip Industry Technical Paper Roundup: Feb. 13


New technical papers added to Semiconductor Engineering’s library this week. [table id=197 /] More ReadingTechnical Paper Library home » read more

Superexchange Coupling Of Donor Qubits In Si For Quantum Computers (UNSW)


A technical paper titled “Superexchange coupling of donor qubits in silicon” was published by researchers at University of New South Wales. Abstract: "Atomic engineering in a solid-state material has the potential to functionalize the host with novel phenomena. STM-based lithographic techniques have enabled the placement of individual phosphorus atoms at selective lattice sites of silicon... » read more

Chip Industry’s Technical Paper Roundup: October 3


New technical papers recently added to Semiconductor Engineering’s library: [table id=150 /] Related Reading Technical Paper Library home » read more

Improving ML-Based Device Modeling Using Variational Autoencoder Techniques


A technical paper titled “Improving Semiconductor Device Modeling for Electronic Design Automation by Machine Learning Techniques” was published by researchers at Commonwealth Scientific and Industrial Research Organisation (CSIRO), Peking University, National University of Singapore, and University of New South Wales. Abstract: "The semiconductors industry benefits greatly from the integ... » read more

Startup Funding: July 2023


Investors pumped more than $2.8 billion into 123 companies July. It was a particularly strong month for photonics companies, with a photonic integrated circuit foundry raising more than $100 million. Startups this month also are using photonic technology in innovative ways. This includes an all-optical RISC processor, biomarker identification, faster fully homomorphic encryption, and more AI... » read more

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