Chip Industry Technical Paper Roundup: Dec. 16


New technical papers recently added to Semiconductor Engineering’s library: [table id=501 /] Find more semiconductor research papers here and in the most recent Chip Industry Week in Review. » read more

Systematic Lithographic Patterning Characterization Of An Al-based Hybrid Resist (Stonybrook, UT Dallas, Brookhaven)


A new technical paper titled "Molecular Layer Deposited Aluminum-Based Hybrid Resist for High-Resolution Nanolithography and Direct Ultra-High Aspect Ratio Pattern Transfer" was published by researchers at Stony Brook University, the University of Texas at Dallas, and Brookhaven National Laboratory. Excerpt "Here, this study reports the systematic lithographic patterning characterization ... » read more

Research Bits: Nov. 4


Diffusive memristor for artificial neurons Researchers from the University of Southern California, University of Massachusetts, University of California Los Angeles, Syracuse University, and the Air Force Research Laboratory developed artificial neurons that replicate the complex electrochemical behavior of biological brain cells. “Our existing computing systems were never intended to pro... » read more

Chip Industry Week in Review


San Francisco-based Substrate raised more than $100 million to build a vertically integrated foundry that uses particle accelerators to produce "the world's brightest beams, enabling a new method of advanced X-ray lithography." The company claims its technology is comparable to ASML's high NA EUV, and notes it can extend well beyond 2nm. ASML has not publicly commented. The Nexperia chip sho... » read more

Chip Industry Week in Review


SEMICON West was held in Phoenix this week, with presentations covering heterogeneous integration, AI, quantum, supply chain resilience, and more. Amid the buzz of the conference, some key manufacturing and test announcements were made this week: The strategic importance of the Phoenix area hub was highlighted. Amkor Technology broke ground this week on its advanced packaging and test camp... » read more

Chip Industry Week in Review


The Chinese Academy of Sciences unveiled a fully automated processor chip design system, claiming the potential to accelerate semiconductor development and replace human programmers. Micron Technology plans to expand its U.S. investments to approximately $150 billion in domestic memory manufacturing and $50 billion in R&D, which is $30 billion higher than previously reported. AMD laun... » read more

Research Bits: Dec. 24


Growing multilayered chips Researchers from MIT, Samsung Advanced Institute of Technology, Sungkyunkwan University, and University of Texas at Dallas developed a method to fabricate a multilayered chip with alternating layers of semiconducting material grown directly on top of each other. The approach enables high-performance transistors and memory and logic elements on any random crystalline ... » read more

Chip Industry Week In Review


Samsung unveiled its latest 2nm and 4nm process nodes, plus its AI solutions during the Samsung Foundry Forum. The company also introduced an aggressive roadmap for the next few years that includes 3D-ICs with logic-on-logic, starting in 2025; custom HBM with built-in logic; backside power delivery on 2nm technology in 2027; and co-packaged optics. In presentations at the event, the company als... » read more

Framework For Early Anomaly Detection In AMS Components Of Automotive SoCs


A technical paper titled “Enhancing Functional Safety in Automotive AMS Circuits through Unsupervised Machine Learning” was published by researchers at University of Texas at Dallas, Intel Corporation, NXP Semiconductors, and Texas Instruments. Abstract: "Given the widespread use of safety-critical applications in the automotive field, it is crucial to ensure the Functional Safety (FuSa) ... » read more

Technical Paper Roundup: November 21


New technical papers recently added to Semiconductor Engineering’s library: [table id=167 /] More Reading Technical Paper Library home » read more

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