Chip Industry’s Technical Paper Roundup: Feb. 28


New technical papers recently added to Semiconductor Engineering’s library: [table id=83 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us ... » read more

Research Bits: Oct. 25


Polarization for photonic processor Researchers from the University of Oxford and University of Exeter developed a photonic processor that uses multiple polarization channels, increasing information density. "We all know that the advantage of photonics over electronics is that light is faster and more functional over large bandwidths. So, our aim was to fully harness such advantages of phot... » read more

Research Bits: Oct. 18


Modular AI chip Engineers at the Massachusetts Institute of Technology (MIT), Harvard University, Stanford University, Lawrence Berkeley National Laboratory, Korea Institute of Science and Technology, and Tsinghua University created a modular approach to building stackable, reconfigurable AI chips. The design comprises alternating layers of sensing and processing elements, along with LEDs t... » read more

Week In Review: Auto, Security, Pervasive Computing


Automotive, Mobility Hyundai announced all of its vehicles will be software-defined vehicles (SDVs) by 2025. The company said all newly launched Hyundai vehicles will be able to receive over-the-air software updates next year, and that it expects to register 20 million vehicles to its Connected Car Services system by 2025. Hyundai also said it will invest the equivalent of more than $12 billio... » read more

Technical Paper Round-up: August 8


New technical papers added to Semiconductor Engineering’s library this week. [table id=44 /] Semiconductor Engineering is in the process of building this library of research papers. Please send suggestions (via comments section below) for what else you’d like us to incorporate. If you have research papers you are trying to promote, we will review them to see if they are a good fit for... » read more

Reservoir Computing HW Based on a CMOS-Compatible FeFET


A new technical paper titled "Reservoir computing on a silicon platform with a ferroelectric field-effect transistor" was published by researchers at the University of Tokyo. Researchers report "reservoir computing hardware based on a ferroelectric field-effect transistor (FeFET) consisting of silicon and ferroelectric hafnium zirconium oxide. The rich dynamics originating from the ferroelec... » read more

Research Bits: May 31


Carbon nanotube transistors Researchers from the National Institute for Materials Science, National University of Science and Technology, Emanuel Institute of Biochemical Physics, Chinese Academy of Sciences, National Institute of Advanced Industrial Science and Technology, University of Tokyo, Tianjin University, and Queensland University of Technology created transistors out of carbon nanotu... » read more

Technical Paper Round-up: May 3


New technical papers added to Semiconductor Engineering’s library this week. [table id=24 /] Semiconductor Engineering is in the process of building this library of research papers. Please send suggestions (via comments section below) for what else you’d like us to incorporate. If you have research papers you are trying to promote, we will review them to see if they are a good fit for... » read more

Pyrolyzed Cellulose Nanofiber Paper (CNP) Semiconductor with a 3D Network Structure


Abstract Semiconducting nanomaterials with 3D network structures exhibit various fascinating properties such as electrical conduction, high permeability, and large surface areas, which are beneficial for adsorption, separation, and sensing applications. However, research on these materials is substantially restricted by the limited trans-scalability of their structural design and tunability of... » read more

Silicon-based Power Semis Face Challenges


Suppliers of power semiconductors continue to develop and ship devices based on traditional silicon technology, but silicon is nearing its limits and faces increased competition from technologies like GaN and SiC. In response, the industry is finding ways to extend traditional silicon-based power devices. Chipmakers are eking out more performance and prolonging the technology, at least in th... » read more

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