Blog Review: Jan. 6

By Jesse Allen - 06 Jan, 2016 - Comments: 0

Mobile is not just about handsets, but also cloud datacenters and the networking to move data back and forth. Cadence's Paul McLellan takes a look at the future of traditional dataservers with the rise of microservers and the use of FPGA accelerators. Mentor's Jay Gorajia has ideas for how to best leverage manufacturing analytics, but says that care must be taken in deciding which data shoul... » read more

Securing IoE Gateways

By Ernest Worthman - 06 Jul, 2015 - Comments: 0

When we talk about the [getkc id="260" comment="Internet of Everything"], (IoE) we have come to realize that it will really be made up of a lot of different “things. It will envelope everything from home automation to intelligent vehicles, to wearables, to industrial applications, military, infrastructure. The list is almost endless. And there is a lot of discussion about securing these “th... » read more

What Ford Is Driving

By Ed Sperling - 04 Mar, 2015 - Comments: 0

Jim Buczkowski, director of electrical and electronics systems research and advanced engineering at Ford Motor Co., sat down with Semiconductor Engineering to talk about quality, security, architectures, packaging and automotive's unique constraints. What follows are excerpts of that conversation. SE: As more electronic content is included in automobiles, what kinds of issues are you dealing... » read more

Meeting The USB IP Requirements Of SoC Designs From 180-nm To 14/16nm FinFET

By Synopsys - 08 Oct, 2014 - Comments: 0

The ubiquitous USB standard provides data and charging capabilities to a multitude of consumer and enterprise products. USB’s ease-of-use and wide availability is belied by USB IP designers’ technical innovations. Without these innovations, USB could not be enabled in a broad range of process technologies ranging from 180-nm to the latest 14/16-nm FinFET technologies. This white paper ad... » read more

Blog Review: Sept. 4

By Ed Sperling - 04 Sep, 2013 - Comments: 0

By Ed Sperling Cadence’s Brian Fuller looks at the opportunity for EDA in the cloud and where it’s most likely to gain traction. How about the PCB? Synopsys’ Mick Posner has moved beyond broad-based design ecosystems. He’s now reaching out to local neighborhoods with FPGA prototypes. Sounds like quality family time. Mentor’s Colin Walls concedes that all non-trivial software ... » read more

Good Times For Analog Designers

By Ann Mutschler - 14 Feb, 2013 - Comments: 1

By Ann Steffora Mutschler For a number of technological reasons, analog/mixed-signal design and low-power design are converging, and with that comes both challenges and opportunities. As far as challenges go, process variations at 14nm, 20nm and even 28nm have increased significantly to include DFM impacts such as layout-delay effects. On the digital side, those process changes affect... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer