Wearables Disconnect

By Brian Bailey - 23 Sep, 2021 - Comments: 0

One of the great opportunities created by the pandemic is a result of conferences going online. I know many people miss the social aspects of not being able to get together with your thousand closest friends, who you see every year at the same shows, but requiring a physical presence is limiting in both time and expense. Personally, I have used the opportunity to "attend" conferences that I wou... » read more

Power/Performance Bits: Sept. 21

By Jesse Allen - 21 Sep, 2021 - Comments: 0

Catching switches in action Researchers from SLAC National Accelerator Laboratory, Stanford University, Hewlett Packard Labs, Penn State University, and Purdue University observed atoms moving inside an electronic switch as it turns on and off, revealing a state they suspect could lead to faster, more energy-efficient devices. "This research is a breakthrough in ultrafast technology and sci... » read more

Will The Fitbit Charge 5 Outshine The Fitbit Luxe?

By Stacy Wegner - 16 Sep, 2021 - Comments: 0

We don’t know, and we do not comment on whether one device is better than its previous generation. What we do is look at and compare generations of devices. And while we wait for our pre-order of our Fitbit Charge 5 to arrive, we will take a look at what Fitbit Luxe has inside of it. Fig. 1: Fitbit Luxe. Fig. 2: Fitbit Inspire 2. The Luxe has other changes from the Inspire 2, inc... » read more

System-In-Package Thrives In The Shadows

By Mark LaPedus - 16 Sep, 2021 - Comments: 0

IC packaging continues to play a big role in the development of new electronic products, particularly with system-in-package (SiP), a successful approach that continues to gain momentum — but mostly under the radar because it adds a competitive edge. With a SiP, several chips and other components are integrated into a package, enabling it to function as an electronic system or sub-system. ... » read more

Challenges With Chiplets And Packaging

By Mark LaPedus - 15 Sep, 2021 - Comments: 0

Semiconductor Engineering sat down to discuss IC packaging technology trends, chiplets, shortages and other topics with William Chen, a fellow at ASE; Michael Kelly, vice president of advanced packaging development and integration at Amkor; Richard Otte, president and CEO of Promex, the parent company of QP Technologies; Michael Liu, senior director of global technical marketing at JCET; and Th... » read more

Power/Performance Bits: Sept. 14

By Jesse Allen - 14 Sep, 2021 - Comments: 0

Thermal management material Engineers at the University of California Los Angeles integrated a new thermal management material, boron arsenide, with a HEMT chip to demonstrate the material's potential. The team developed boron arsenide as a thermal management material in 2018 and found it to be very effective at drawing and dissipating heat. In the latest experiments, they used wide band... » read more

How Chips Will Change Health Care

By Ed Sperling - 25 Aug, 2021 - Comments: 0

Jo De Boeck, chief strategy officer and executive vice president at imec, sat down with Semiconductor Engineering to talk about the intersection of medical and semiconductor technology, what's changing in how chips are being used, and what will happen in the short term and long-term. What follows are excerpts of that discussion. SE: Medical technology never advanced at the rate everybody... » read more

Power/Performance Bits: Aug. 17

By Jesse Allen - 17 Aug, 2021 - Comments: 0

Digital fiber Researchers at MIT, Harrisburg University of Science and Technology, and Rhode Island School of Design developed a digital fiber that can sense, store, analyze, and infer activity after being sewn into a shirt. "This work presents the first realization of a fabric with the ability to store and process data digitally, adding a new information content dimension to textiles and a... » read more

Power/Performance Bits: June 7

By Jesse Allen - 07 Jun, 2021 - Comments: 0

Commercializing photonic MEMS Researchers from the University of California Berkeley, Daegu Gyeongbuk Institute of Science & Technology, SUSS MicroOptics, TSI Semiconductors, Gwangju Institute of Science and Technology, KAIST, Ecole Polytechnique Fédérale de Lausanne (EPFL), and Korea Polytechnic University demonstrated a path for commercial fabrication of photonic MEMS. Photonic MEMS... » read more

Power/Performance Bits: April 27

By Jesse Allen - 27 Apr, 2021 - Comments: 0

Energy-harvesting shirt Engineers at the University of California San Diego developed a 'wearable microgrid' that harvests and stores energy from the human body to power small electronics. The microgrid consists of three main parts: sweat-powered biofuel cells, motion-powered triboelectric generators, and energy-storing supercapacitors. All parts are flexible, washable and can be screen pri... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.